The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
Advanced chip manufacturing and advanced packaging have now become the focus of attention in China. SMIC already confirmed that it had adopted deep ultraviolet (DUV) lithography machines...
Inventory adjustments for industrial and automotive chips are still in progress, while those for other applications have returned to normal levels, according to sources at IC distr...
OpenAI Chief Executive Officer Sam Altman has been working to build a global coalition among government and industry leaders to support boosting the supply of chips, energy, and data...
TSMC will be receiving less US Chips Act subsidy than Intel, but DIGITIMES Research believes the Taiwanese pure-play foundry's fabs in Arizona will still be competitive due to its...
As AI PCs become more common, touch and fingerprint recognition chips will lead the way among related ICs riding the initial AI PC wave, according to industry sources.
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
TSMC today announced that the US Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding...
The US is asking South Korea to adopt restrictions on semiconductor technology exports to China similar to those Washington has already implemented, another sign the Biden administration...
