Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation, light etching and processing, as well as UV photoresist curing and charge erase. It also manufactures UV curing equipment, focusing on equipment used in compound semiconductor processes. These equipment are used in the production of wide-bandgap semiconductor power devices such as silicon carbide (SiC) and gallium nitride (GaN), as well as other important processes such as communication power amplifiers (PAs). Trymax has been established for over 25 years and has a considerable customer base and brand recognition in the Taiwanese market. At Semicon Taiwan 2025, the company primarily serves to promote its products and connect with key clients. With a product portfolio ranging from 100mm to 300mm wafer size, Trymax's clients are on both sides of the Taiwan Strait becoming major suppliers to the manufacturers of power amplifiers and RF components. In the global presence, Trymax has significant market shares at foundries, IDMs and wafer level packaging houses for end applications in Power semiconductor, automotive, MEMS, LED and CMOS. Trymax's NEO series plasma dry descum systems are suitable for cleaning and activation processes in the semiconductor industry, offering high efficiency, uniformity, and repeatability. These systems utilize RF/microwave power to generate high-energy, disordered plasma under vacuum conditions. They can process a wide range of substrate sizes and offer a variety of processing technologies for flexible customer selection, meeting the needs of diverse semiconductor process technologies. Trymax continuously innovates to support its customers' needs. In addition to the compound semiconductor processes, it is also widely used in application fields such as MEMS microelectromechanical systems, microfluidic devices, SOI substrate manufacturing, advanced packaging and optoelectronic displays. Among them, the global installed capacity of NEO system equipment has exceeded 300 sets.

AGI Technology, the innovative Taiwanese memory brand, has successfully concluded its showcase at CES 2026. Located at Bellini 2001B in The Venetian Resort, Las Vegas, AGI presented its next-generation high-speed and mobile storage solutions under the theme "Powering What's Next with AGI Innovation", attracting interest from global brand partners, system integrators, and professional creators.With the rapid proliferation of AI in PCs and mobile devices, the demand for high-resolution media, real-time content generation, and edge AI applications has been surging. AGI emphasizes that storage is no longer just about capacity; it has become a critical factor determining system performance, bandwidth, mobility, and reliability.The AGI President, Miranda Lee, stated, "High-speed and high-capacity storage are now a market baseline. The differentiator lies in aligning solutions with real-world usage scenarios and maintaining consistent supply and quality. In the fast-changing AI era, AGI continuously adapts its product strategy and brand positioning to meet market expectations for practical usability."CES 2026 Product Highlights: Empowering High-Performance ComputingTo support the demands of AI and high-performance applications, AGI showcased its complete next-generation storage lineup, focusing on high-performance platforms and mobile usage:1.PCIe Gen5 SSD (Project S10): Designed for intensive workloads, delivering top-tier performance while managing power consumption and heat dissipation for sustained stability.2.DDR5 Overclocking Memory (Project K10): Engineered for AI-driven platforms and high-end gaming, offering extreme bandwidth to handle complex, high-speed data processing, ensuring stability.3.Portable SSD Series: Tailored for mobile content creation and outdoor professionals, the PSSD series emphasizes durability and high-speed transfer to ensure creative work and memories are quickly and securely preserved.A User-Centric Approach for Global MarketsThe AGI President Miranda Lee further noted that AI not only accelerates the capacity demands but also reshapes how data is accessed and transferred, making portable storage essential to modern creative workflows. Rather than competing solely on technical specifications, AGI focuses on user scenarios, integrating long-term value and stability into the product design. During CES, AGI engaged in in-depth technical and market discussions with global partners, strengthening its international distribution network through its precise product roadmaps.  Looking Forward: Stability and Practicality at the Core of the BrandCES 2026 served as a pivotal milestone for AGI's expansion. Moving forward, AGI will continue investing in high-speed interfaces and performance optimization, ensuring its products deliver outstanding stability in real-world scenarios, staying true to the brand promise: Preserve Your Uniqueness.AGI is a leading provider of high-performance storage solutions, dedicated to delivering innovative products that cater to the evolving needs of its customers. With a commitment to offering cutting-edge storage capacity and superior performance, AGI empowers users with reliable solutions for an enhanced digital experience.AGI GR0NNLUX 10K showcased DDR5 Overclocking RGB Memory Module. Credit: AGITechnologyAGI's booth saw a steady stream of visitors, highlighting strong market interest. Credit: AGI TechnologyAGI's booth saw a steady stream of visitors, highlighting strong market interest. Credit: AGI Technology

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries. The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection. The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time.Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own. Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.