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Tuesday 13 October 2026
Terafab and beyond: Musk's push to fuse silicon, robotics, space into one AI system
As plans for the Terafab project begin to take shape, the emergence of a scaled chipmaking initiative increasingly reflects Elon Musk's broader ambition to push vertical AI integration...
Tuesday 13 October 2026
Toyota rewires China JV structure as GAC takes control of FAW Toyota stake
As the push toward smarter vehicle systems and full electrification intensifies alongside China's strengthening position in the EV market, these trends are increasingly prompting overseas...
Tuesday 13 October 2026
China's AI revenue gap with US exposes deeper monetisation divide
China's leading artificial intelligence companies are gaining users and global recognition, but their commercial returns remain far behind those of US rivals. The growing disparity...
Tuesday 13 October 2026
BTL sees AI testing surge, schedules extend to 1Q27
Electronic testing laboratory BTL reported September 2026 revenue of NT$87 million (US$2.73 million), up 10.2% year-over-year, as AI server testing projects at its second Guishan plant...
Tuesday 13 October 2026
AI growth outlook stays strong as risk-free returns come under pressure
Capital expenditure by the top four US cloud service providers (CSPs) is projected to expand further in 2027. Meanwhile, nations such as France and Saudi Arabia are aggressively constructing...
Tuesday 13 October 2026
Taiwan's ICT sector enjoys 3-year boom as US debt swells
Driven by robust demand for AI, high-performance computing (HPC), and cloud data services, Taiwan's information and communications technology (ICT) production momentum has soared for...
Monday 12 October 2026
Microsoft to scale Maia AI chips to multi-gigawatt deployments, unveils TSMC N2P-based Maia 300
Microsoft will scale its in-house Azure Maia AI accelerators to multi-gigawatt deployments starting in 2027, making Maia the primary AI inference system for its products and services...
Monday 12 October 2026
Microsoft's Maia 300 rack: 96 accelerators, HBM4, mostly liquid-cooled
Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up...
Monday 12 October 2026
China proposes physical controls and tougher testing for new vehicles
China proposed tighter vehicle design and safety requirements that would restrict fully hidden door handles, virtual controls for critical functions and several interior features in...
Monday 12 October 2026
Finland orders Google to halt work at two AI data center sites
Finnish authorities ordered Google to suspend parts of construction at planned AI data centers in Muhos and Kajaani after forests were allegedly cleared at the sites before an environmental...
Monday 12 October 2026
EU caps annual HEV imports at 350,000 to curb trade deficit with China
The European Union plans to cap imports of hybrid electric vehicles (HEVs) at 350,000 units per year, with safeguard measures potentially taking effect as early as December 1, 2026...
Monday 12 October 2026
DIGITIMES Insight: Personal AI agents could reshape who controls the smart cockpit experience

Meta's recent introduction of its personal AI agent, Muse, has renewed interest in AI assistants capable of operating across devices. Unlike conventional...

Monday 12 October 2026
Moonshot AI's Hong Kong IPO faces a critical ownership dispute ahead of US$50 billion debut
China's Moonshot AI is seeking to settle a shareholder dispute involving claims potentially exceeding US$700 million ahead of a potential US$5 billion Hong Kong initial public offering...
Monday 12 October 2026
Microsoft calls for observable AI systems with emergency shutdown controls
Microsoft urged organizations to design artificial intelligence systems as observable, controllable infrastructure rather than opaque "black boxes," arguing that people must be able...
Monday 12 October 2026
Sumitomo Bakelite expands packaging material production across Singapore, China
Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This...