Face to face

Interviews with executives in the supply chain

IN THE NEWS

Saturday 19 September 2026

Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Wednesday 16 September 2026

Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec

The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...

Tuesday 15 September 2026

Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

Tuesday 15 September 2026

The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips

"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...

Saturday 12 September 2026

ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs

Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.

Saturday 12 September 2026

Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line

Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...

Wednesday 9 September 2026

Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

Monday 7 September 2026

Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions,...

Monday 7 September 2026

Exclusive: Infineon COO says chip shortage recovery will take longer

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will...

Saturday 5 September 2026

Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race

"Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as...

Saturday 5 September 2026

Interview: Agility Robotics CTO discusses the future of collaborative humanoid robotics

Excitement is growing among investors and the public over the rising capabilities of humanoid robots. Yet as robot makers seek to turn their lab-built innovations into real-world commercial...

Monday 31 August 2026

Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift

As global net-zero efforts intensify, governments and major technology companies are investing in emerging nuclear technologies to meet the huge electricity demand from AI data centers...

Saturday 29 August 2026

Exclusive Interview: Turning scale into value — AUO chair's post-LCD ambition

Price wars. Capacity races. Years of losses steep enough to earn a lasting nickname.

Monday 24 August 2026

Etron chair sees memory boom extending to 2028-2030

The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...

Monday 24 August 2026

AI chip roadmaps force faster changes in data-center design, Cadence says

Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...

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