Face to face

Interviews with executives in the supply chain

IN THE NEWS

Saturday 26 September 2026

Interview: Taiwan's H2U helps companies manage employee health with AI, eyes third markets with South Korea

When companies discuss ESG, they often emphasize environmental issues and compliance while paying less attention to employee health, a key component of the social dimension, according...

Friday 25 September 2026

Interview: Intel director talks physical AI, business models, and robotics' future

Physical AI is accelerating like never before. Autonomous intelligent machines can walk, run, fly, swim, and assemble car parts in under a minute. New advances in AI models and technologies...

Friday 25 September 2026

Interview: GMI Cloud bets on Taiwan as a proving ground for global AI expansion

GMI Cloud is making Taiwan a key part of its global AI infrastructure expansion, with a US$500 million investment in an AI factory powered by Nvidia's Blackwell GPUs. Announced in...

Friday 25 September 2026

From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors

India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped...

Saturday 19 September 2026

Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Wednesday 16 September 2026

Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec

The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...

Tuesday 15 September 2026

Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

Tuesday 15 September 2026

The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips

"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...

Saturday 12 September 2026

ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs

Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.

Saturday 12 September 2026

Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line

Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...

Wednesday 9 September 2026

Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

Monday 7 September 2026

Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions,...

Monday 7 September 2026

Exclusive: Infineon COO says chip shortage recovery will take longer

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will...

Saturday 5 September 2026

Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race

"Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as...

Saturday 5 September 2026

Interview: Agility Robotics CTO discusses the future of collaborative humanoid robotics

Excitement is growing among investors and the public over the rising capabilities of humanoid robots. Yet as robot makers seek to turn their lab-built innovations into real-world commercial...

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