Face to face

Interviews with executives in the supply chain

IN THE NEWS

Friday 9 October 2026

Interview: How AI forecasting and energy scheduling are raising the bar for green power sellers

As the demand for green energy surges in parallel with order volumes and production capacity, scheduling for energy storage systems has become a critical technology to solve the problem...

Friday 9 October 2026

Interview: Europe's enterprise networking market returns to growth as pandemic inventory hangover clears

The European enterprise networking market has cleared its multi-year inventory digestion period. According to CONTEXT, sell-through via European distribution channels is growing in...

Monday 5 October 2026

Exclusive: A*STAR IME's Yu-chieh Chien targets next-gen SiC through 8-inch R&D, reliability gains

Singapore is building a semiconductor R&D hub by attracting both multinational investment and overseas research talent. Dr Yu-chieh Chien,...

Saturday 3 October 2026

Interview: AI PCs reach 65% of Europe's notebook channel, but what brings buyers to the market?

The rapid iteration of AI-capable hardware, following an industry-wide push toward integrating AI-processing capabilities into PCs, is bringing renewed attention to what AI could offer...

Wednesday 30 September 2026

Interview: iFLYTEK Medical sees clinical integration as key to healthcare AI expansion in South Korea

Xunfei Healthcare (iFLYTEK Medical), the healthcare AI arm of China's iFlytek, is using its Spark Medical Large Model to support diagnosis and medical record generation while tackling...

Tuesday 29 September 2026

Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard

As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...

Tuesday 29 September 2026

Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win

In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...

Saturday 26 September 2026

Interview: Taiwan's H2U helps companies manage employee health with AI, eyes third markets with South Korea

When companies discuss ESG, they often emphasize environmental issues and compliance while paying less attention to employee health, a key component of the social dimension, according...

Friday 25 September 2026

Interview: Intel director talks physical AI, business models, and robotics' future

Physical AI is accelerating like never before. Autonomous intelligent machines can walk, run, fly, swim, and assemble car parts in under a minute. New advances in AI models and technologies...

Friday 25 September 2026

Interview: GMI Cloud bets on Taiwan as a proving ground for global AI expansion

GMI Cloud is making Taiwan a key part of its global AI infrastructure expansion, with a US$500 million investment in an AI factory powered by Nvidia's Blackwell GPUs. Announced in...

Friday 25 September 2026

From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors

India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped...

Saturday 19 September 2026

Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Wednesday 16 September 2026

Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec

The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...

Tuesday 15 September 2026

Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

Tuesday 15 September 2026

The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips

"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...

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