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Thursday 8 October 2026
Sasken eyes reusable chip IP as India pushes beyond semiconductor design services
India-based engineering firm Sasken Technologies plans to license company-owned semiconductor interconnect intellectual property (IP) to multiple customers, marking an effort to move...
Thursday 8 October 2026
Samsung to exit in-house automotive AP, focus on high-margin chips
Samsung Electronics' System LSI division is reportedly planning a retreat from the automotive application processor (AP) business and launching a major restructuring, with a future...
Tuesday 6 October 2026
Huawei's Kirin 9050 Pro reveals new logic folding chip design
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan...
Thursday 24 September 2026
Qualcomm splits flagship mobile SoCs into more tiers
Qualcomm is launching two flagship platforms in 2026—the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Extreme Gen 6—signaling a new era of finer-grained flagship...
Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...
Monday 21 September 2026
Podcast highlights: Apple could take the lead in foldable share
DIGITIMES analyst Luke Lin said on his podcast that the foldable's pricing is more consumer-friendly than expected, but Apple's across-the-board price hikes on older models...
Friday 18 September 2026
Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI
Apple unveiled its iPhone 18 Pro series featuring its inaugural 2nm smartphone silicon, the A20 Pro, which was followed by MediaTek's announcement of its own 2nm Dimensity 9600 Pro...
Thursday 17 September 2026
Samsung expands SRAM, IP to speed chip development

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster...

Wednesday 16 September 2026
MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging...

Tuesday 15 September 2026
2nm capacity crunch may keep smartphone SoC makers on split-node strategy through 2027

In 2026, major smartphone system-on-chip (SoC) vendors began moving selected flagship processors to 2nm technology, seeking not only...

Friday 11 September 2026
Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit
Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU,...
Monday 7 September 2026
SiliconAuto pushes AI chiplets as automotive SoC ties tighten
Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...
Friday 4 September 2026
Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains
As end-to-end (E2E) autonomous driving architectures gradually become mainstream, the inference demands of physical AI are driving radical transformations in automotive system-on-chip...
Monday 31 August 2026
SiFive BigSky brings RISC-V into data centers with CUDA, Nvidia links and enterprise Linux
SiFive has introduced its BigSky SF-2U870 development server, positioning the 2U rack system as a platform for hyperscalers, software vendors and SoC developers to port server workloads...