Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based...
With the generative AI boom in full swing, the supply chain is shifting its focus to developing edge AI device applications. In 2024, AI PCs and smartphones will undergo market sales...
Winbond Electronics, a Taiwanese maker of specialty DRAM and NOR flash memory, has authorized NT$1.286 billion (US$41.4 million) in capital expenditures. The money will be used to...
The Taiwan Carbon Solution Exchange (TCX) has officially started trading, marking a significant moment in carbon exchange activities. Winbond Electronics Corporation (WEC), a total...
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
The evolution of generative AI from the cloud to edge applications has awakened the PC industry from its long slumber, as AI PCs become the name of the game for leading PC makers...
Taiwan-based memory IC design houses including Etron Technology and AP Memory have stepped up their deployment in the edge AI market segment, which is expected to grow through 2025...
Price declines in NOR flash memory will moderate and narrow to less than 10% in 2024, according to Pei-Ming Chen, president of Taiwan-based Winbond Electronics.
The Taiwan-based semiconductor manufacturer Winbond is gearing up for a significant uptick in the demand for high-bandwidth memory (HBM), driven by the rise of generative AI. Chen...
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
