中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    LG Electronics's three strategies to counter competition from Chinese brands
    4h 1min ago
    China's SeeYA wins Meta’s MR panel order as BOE misses certification
    4h 1min ago
    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
    4h 1min ago
    InP enters a capacity race as TCL moves into indium phosphide laser chips
    4h 2min ago
    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
    4h 2min ago
    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
    4h 2min ago
    NEWS TAGGED MANAGEMENT
    Tuesday 1 September 2026
    Apple reshuffles leadership, shifts Schiller out of App Store
    Apple has made another major management shake-up. After Tim Cook stepped down as CEO and was succeeded by John Ternus, formerly head of hardware engineering, veteran Phil Schiller...
    Tuesday 1 September 2026
    Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion
    As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...
    Tuesday 1 September 2026
    Samsung weighs HBM4 bonuses as memory, foundry teams align
    Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
    Tuesday 1 September 2026
    LGD launches PFAS exit roadmap, targets full phaseout by 2035
    LG Display (LGD) has introduced a new "PFAS-free" component verification process for suppliers as it prepares for expected European Union (EU) restrictions on PFAS, aiming to eliminate...
    Friday 28 August 2026
    Winstar's AI push gains momentum with some orders extending into 2027
    Winstar Display is accelerating its expansion into AI applications, with its products already integrated into data centers, power management systems, controllers, testing equipment,...
    Friday 28 August 2026
    Renesas opens physical AI, robotics lab in Beijing
    Renesas Electronics has opened a physical AI and robotics lab in Beijing, a move that could speed the development of safer, smarter machines for factories, logistics, and homes worldwide...
    Thursday 27 August 2026
    HTSI targets AI chip demand with SiPh, CPO, packaging push
    Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...
    Wednesday 26 August 2026
    Taiwan AI Cloud flags four demands for AI from POC to production
    Taiwan AI Cloud General Manager Han-chang Wu said at the 2026 Taiwan Sustainability Summit on August 25 that as open-source models mature, computing power becomes easier to access,...
    Tuesday 25 August 2026
    China foundry Nexchip breaks beyond display chips: CIS reaches 25% of revenue
    Nexchip Semiconductor reported higher first-half 2026 revenue as broadening demand for CMOS image sensors, power management chips and display drivers diversified its product mix, even...
    Tuesday 25 August 2026
    Infineon buys India-based C2i Semiconductors to bolster AI data center power systems
    Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing...
    Tuesday 25 August 2026
    Inergy server share hits 47% on cooling, BBU demand

    Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47%...

    Monday 24 August 2026
    UAE weighs investment in 500 MW AI data center plan in Japan
    The United Arab Emirates is considering backing a proposed 500 MW AI data center in Akita prefecture, Japan, after local officials met with the UAE ambassador on Aug. 19. The project,...
    Monday 24 August 2026
    AMRA expands robot testing standard to cover legged systems
    The Autonomous Mobile Robot Alliance (AMRA), formed by Taiwan's Industrial Technology Research Institute and industry, academia, and research partners, has released a new standard...
    Saturday 22 August 2026
    Column: Lessons in supply chain resilience from China Huadian's power-compute coordination model
    As AI develops rapidly, data centers are driving equally rapid growth in electricity demand. The stability of future energy supplies will directly determine whether AI computing capacity...
    Wednesday 19 August 2026
    Alibaba's Lingxi sale shows how AI is redrawing China's Big Tech priorities

    As AI infrastructure increasingly absorbs both capital and management attention across China's technology sector, even profitable businesses...

    1/31 pages
    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    reportAIglasses