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NEWS TAGGED HPC
Friday 24 December 2021
Molding compounds to see worst crunch among packaging materials in 2022
Taiwan-based OSATs will experience mixed supply of packaging materials, with molding compounds to see the worst crunch beyond ABF substrates, and wirebonding leadframes and DAF (die...
Wednesday 22 December 2021
ABF substrate supply to see 20% shortage throughout 2022, says Unimicron
The supply of ABF substrates will continue to be at least 20% short of demand in 2022, and the crunch may start to ease only after most of new capacities at suppliers come online...
Wednesday 22 December 2021
High-end IC testing demand to stay robust in 2022
Testing demand for HPC chips, mobile application processors, wireless connectivity chips, and other high-end logic chips will stay strong in 2022, according to sources at Taiwan-based...
Monday 20 December 2021
Unimicron to increase 2022 capex on ABF substrate capacity for non-Intel clients
Taiwan's leading IC substrate maker Unimicron Technology has recently scaled up its capital expenses for 2022 to NT$35.858 billion (US$1.287 billion) from the originally planned level...
Thursday 16 December 2021
TSMC intros N4X process
TSMC has introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products.
Monday 13 December 2021
Foundry capacity to stay tight in 2022 as global IC shortage lingers
Foundry capacity supply will remain tight in 2022 as global IC shortage has yet to ease and IC designers continue to seek more capacity support, although demand for certain chips...
Tuesday 7 December 2021
Nan Ya upbeat about CCL and other electronic materials sales
Taiwan-based Nan Ya Plastics has expressed optimism about sales of its CCLs and other electronic materials, citing brisk demand for 5G, automotive and HPC related applications.
Wednesday 1 December 2021
Supply chain cooperation crucial to address SiP challenges, says ASE VP
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
Wednesday 1 December 2021
TSMC advanced packaging enters next phase of development, says company VP
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
Friday 26 November 2021
IC test interface vendors poised to embrace booming demand for HPC chips
Peripheral backend supply chain players including makers of high-end customized IC testing sockets, wafer probe cards and burn-in boards, apart from ABF substrates, are all gearing...
Friday 26 November 2021
Shortage of ABF substrates for notebook processors to widen in 2022
In the notebook processor supply chain, ABF substrates will be among certain components that will see shortage widen in 2022, which may tighten supply of notebook processors affecting...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Thursday 25 November 2021
Samsung to set up advanced wafer fab in Texas
Samsung Electronics has announced plans to invest an estimated US$17 billion in the establishment of a new semiconductor manufacturing facility in Taylor, Texas. The fab will be dedicated...
Wednesday 24 November 2021
Metaverse applications to bring new opportunities for memory supply chain
Looming metaverse applications are expected to generate massive data drastically triggering storage demand, which will generate new business opportunities for memory vendors and backend...
Monday 22 November 2021
8-inch fabs to enjoy robust business growth through 2026, says VIS chair
Eight-inch wafer foundry business will continue to enjoy robust growth momentum through 2026 due to limited increase in new capacity, despite market concerns that aggressive capacity...