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Tuesday 25 November 2025
Samsung reportedly begins mass production of Exynos 2600
Samsung Electronics has reportedly launched mass production of its latest mobile application processor, the Exynos 2600, sparking increased activity across South Korea's semiconductor...
Tuesday 25 November 2025
YMTC rockets to 13% shipment share in NAND Flash, Micron now in sight
Yangtze Memory Technologies Corp (YMTC) has strengthened its position in the global NAND Flash market, exceeding a 10% shipment share in the first quarter of 2025 and rising to 13%...
Monday 24 November 2025
Micron denies redesign of HBM4, confirms 2026 launch with full bookings
Micron has rejected reports claiming it is redesigning its HBM4 product due to failure to meet Nvidia's data transfer requirements. The company stated that HBM4 will be launched as...
Tuesday 18 November 2025
Samsung set to become Nvidia's leading HBM4 supplier as Micron stumbles
South Korea's KB Securities expects Samsung Electronics to capture as much as 40% of Nvidia's supply share for its next-generation HBM4 high-bandwidth memory by 2026, a shift that...
Wednesday 12 November 2025
Micron reallocates CHIPS Act funds to Idaho, delaying New York fabs
US memory giant Micron will postpone the commissioning of its first two fabs in Clay, New York, by 2–3 years and will reallocate part of the funding from the CHIPS and Science...
Thursday 6 November 2025
SK Hynix tight-lipped on Nvidia supply terms as HBM4 prices climb
SK Hynix has reportedly increased the price of its sixth-generation high-bandwidth memory (HBM4) supplied to Nvidia by over 50% compared to the previous generation HBM3E. Industry...
Thursday 6 November 2025
Samsung's HBM4 yields surge toward Nvidia certification, SK Hynix keeps edge
Nvidia's evaluation of sixth-generation high-bandwidth memory (HBM4) has sparked a fierce contest among suppliers. ETNews reports that the company plans to finish testing...
Wednesday 5 November 2025
Micron's reported HBM4 delay could cede AI chip advantage to Samsung and SK Hynix
Micron Technology is reportedly redesigning its sixth-generation high-bandwidth memory (HBM4) after facing yield and performance issues, a setback that could push back supply until...
Tuesday 4 November 2025
CXMT launches LPDDR5X to target mid-high-end mobile market
CXMT has released its LPDDR5X products on its official website to coincide with rising global memory prices. Many major companies, such as Samsung, SK Hynix, and Micron, are benefitting...
Thursday 30 October 2025
Texas Instruments sees 50% YoY data center growth amid signs of slower recovery
As US semiconductor companies race to expand domestic manufacturing capacity, Texas Instruments (TI) and Micron Technology are emerging as the most aggressive investors, committing...
Monday 27 October 2025
Weekly news roundup: TSMC tightens China orders; Micron sees DRAM market tightening; CXMT, Huawei advance HBM3 chips
Below are the top DIGITIMES Asia stories from October 20 to 26, 2025.
Monday 27 October 2025
Samsung and Hanmi thaw ties at SEDEX, eye HBM4 collaboration
Longtime rivals Samsung Electronics and Hanmi Semiconductor may be wiping the slate clean and possibly teaming up after South Korea's 27th Semiconductor Exhibition (SEDEX...
Sunday 26 October 2025
CXMT, Huawei align on HBM3 ahead of China's 2026 AI memory leap
High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear up for HBM4 mass production in 2026, China's...
Friday 24 October 2025
Micron begins sampling 192GB low-power DRAM module for AI servers

Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power...

Thursday 23 October 2025
Global top-3 memory maker status, 3Q25

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