Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The...
Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory,...
The US government's move to add Chinese panel makers BOE and Tianma to a military-related list is raising concerns that Washington's...
Samsung Electronics chairman Lee Jae-yong said Gwangju is being considered as a candidate site for Samsung's next semiconductor complex,...
South Korea's government is preparing to designate Physical AI, the convergence of robotics and artificial intelligence, as a new national...
Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in...
LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as...
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...
