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Friday 13 November 2026
Samsung weighs separating memory and mobile leadership
Samsung Electronics may appoint separate heads of its memory and mobile businesses in an upcoming executive reshuffle, as record semiconductor profits contrast with losses in its consumer...
Friday 13 November 2026
Korean labor minister hears chipmakers on 52-hour cap amid dragging special-zone talks
South Korea's labor minister met semiconductor companies on November 13 to hear how the 52-hour workweek cap affects their research and development staff, as unions, employers, and...
Friday 13 November 2026
Samsung reportedly in talks to acquire data center cooling firm Modine
Samsung Electronics is in talks to acquire US data center cooling equipment maker Modine Manufacturing, Bloomberg reported on November 12, as the South Korean company expands...
Friday 13 November 2026
China's eSSD order opens up US market opportunity for Samsung, SK Hynix
Samsung Electronics and SK Hynix are redirecting some enterprise solid-state drive (eSSD) supplies originally intended for Chinese customers to US cloud service providers (CSPs), following...
Friday 13 November 2026
Samsung reportedly wins more AI chip orders from US cloud firms
Samsung Electronics has reportedly secured new AI chip manufacturing orders from major US cloud service providers for a second consecutive quarter, with commercial shipments expected...
Friday 13 November 2026
SK Hynix, Intel explore shared memory to ease AI bottlenecks
SK Hynix is working with Intel and other industry partners to develop memory-centric computing architectures that would allow AI servers to share memory resources, as agentic AI drives...
Friday 13 November 2026
Samsung expands HBM packaging at Onyang as Cheonan runs short of space
Samsung Electronics is expanding its high-bandwidth memory (HBM) packaging operations in South Korea as its Cheonan campus runs short of space, prompting the company to develop nearby...
Friday 13 November 2026
SK Hynix's HBM4 yield tops 70% as Samsung expands chip packaging capacity
SK Hynix's sixth-generation high-bandwidth memory (HBM4) production yield has reportedly surpassed 70%, Chosun Biz reported on November 12, citing semiconductor industry sources,...
Friday 13 November 2026
Samsung reportedly moves up 8-inch foundry exit to 2029, outsources some production to UMC
Samsung Electronics is targeting an exit from its 8-inch foundry business by the end of 2029, a year earlier than previously reported, and has been outsourcing some production to Taiwan's...
Thursday 12 November 2026
Naver signs US$1.5 billion AI cloud deal with US firm
Naver said on November 12 it had signed a KRW2 trillion (approx. US$1.5 billion) AI computing services contract with a US-based AI inference company, securing its first major customer...
Thursday 12 November 2026
Sam Altman warns Samsung of short-term AI demand volatility
OpenAI CEO Sam Altman warned Samsung Electronics executives that AI memory demand could fluctuate in the short term, with the market potentially counting the same demand more than...
Thursday 12 November 2026
South Korea’s HBM demand drives 54% surge in Taiwan glass fiber exports
Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded...
Thursday 12 November 2026
Samsung Display, BOE weigh low-cost OLED panels as phone sales fall
Samsung Display, BOE Technology Group and Tianma Microelectronics are considering cheaper OLED panels for budget smartphones to boost factory utilization as handset sales decline,...
Thursday 12 November 2026
Apple, Samsung reportedly developing new foldable glass for 2028
Apple and Samsung Electronics are working with suppliers on foldable phone glass that is thinner at the hinge and thicker elsewhere, a design they are considering for 2028 models,...
Thursday 12 November 2026
Samsung, AMD team up to upgrade chip testing
Samsung Electronics and AMD are teaming up to upgrade the Korean chipmaker's semiconductor manufacturing test infrastructure, combining AMD's new EPYC Embedded 9006 processors with...