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Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...
Monday 14 September 2026
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company...
Monday 14 September 2026
Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC),...

Monday 14 September 2026
CPO nears mass production — next battle about interfaces, yield and maintenance
As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
Monday 14 September 2026
AI infrastructure race shifts to Grid-to-Chip as Foxconn, Delta, Flex converge on the same track

As computing power and per-rack power density for AI servers continue to climb, industry competition is expanding beyond GPUs, servers,...

Monday 14 September 2026
Aurotek posts record August revenue on semiconductor, robot shipments

Taiwanese robotics component maker Aurotek attributed its strong revenue growth in August 2026 to continued robust customer pull-ins...

Monday 14 September 2026
Renesas readies second price hike amid stronger power-chip demand

Renesas Electronics is reportedly preparing a second product price increase this year, with new pricing set to take effect January 1,...

Monday 14 September 2026
India roundup: India says it cannot build electronics without China
India is accelerating its semiconductor and electronics ambitions, courting Taiwan, easing China restrictions, expanding local manufacturing and chip infrastructure, while global technology...
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan

As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial...

Saturday 12 September 2026
Luxshare eyes AR glasses breakthrough through car HUD model

At the 2026 China International Optoelectronic Exposition (CIOE), Luxshare and its lens module unit Luxvisions jointly showcased multiple...

Friday 11 September 2026
Why Chinese automakers' aggressive push only further tightens CATL's grip
Supply diversification has long been a recurring — and difficult — issue confronting the high-tech manufacturing ecosystem. But efforts to diversify component and materials...
Friday 11 September 2026
Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the...
Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Friday 11 September 2026
Huawei stakes out the AI optics rulebook with 7.2Tbps NPO
Huawei Technologies has unveiled a 7.2-terabit-per-second near-packaged optics (NPO) module for AI data centres, coupling a high-bandwidth product launch with an effort to shape emerging...
Friday 11 September 2026
Beyond Earth's orbit: how Besxar, Space Forge, Varda, BioOrbit, Voyager are industrializing space

A pioneering cohort of space startups is betting that the key to unlocking next-generation technology lies off Earth. Armed with millions...