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Thursday 15 October 2026
US AI data center power shortages drive demand for hybrid solar, natural gas and geothermal systems
The rapid expansion of AI data centers in the US is placing growing pressure on conventional power grids, as their substantial and highly variable electricity requirements strain available...
Thursday 15 October 2026
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Thursday 15 October 2026
Column: 3D memory could redraw chip competition, weaken US sanctions on China
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
Thursday 15 October 2026
Samsung, Applied Materials back startup targeting chip packaging warpage
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...
Thursday 15 October 2026
Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem
GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate...
Thursday 15 October 2026
Delta Electronics' 13.8kV SST gains traction in China, with US cloud giant testing AI data centre microgrids
Delta Electronics unveiled its prefabricated solid-state transformer (SST) DC power solution at Energy Taiwan 2026 on October 14, targeting power efficiency, deployment speed and supply...
Thursday 15 October 2026
Genius Electronic Optical secures US$150 million 3M investment for optical communications
Genius Electronic Optical, a leading manufacturer of optical lenses and precision optical components, announced on October 15 that it had formed a strategic partnership with 3M, a...
Thursday 15 October 2026
Intel Israel fab explosion kills 1, seriously injures 2 workers
An explosion and fire at Intel's wafer fab in Kiryat Gat, southern Israel, on October 14, 2026, seriously injured three employees, one of whom later died of his injuries. Authorities...
Thursday 15 October 2026
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be...
Thursday 15 October 2026
US urges chipmakers to use domestic capacity as CHIPS Act strategy shifts from fab subsidies to securing orders
Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West...
Thursday 15 October 2026
StarSeeds, Kaga Electronics target December 2026 AI server production in Japan
Kaga Electronics and AI infrastructure provider StarSeeds have signed a basic contract manufacturing agreement to produce AI servers at a partner facility in Japan, targeting mass...
Thursday 15 October 2026
Auden expects stronger growth in 2027, sees satellite industry taking another 2–3 years to gain momentum
RF antenna and communications technology company Auden Techno recently inaugurated its global headquarters and R&D center in Bade, Taoyuan. Chairman Chang Yu-Pin said the company's...
Thursday 15 October 2026
Each 1% tariff hike could add US$3.5B to US fab costs, SIA warns
The Semiconductor Industry Association (SIA) urged the Trump administration to reduce tariffs on imported semiconductor materials and equipment, warning that higher costs could undermine...
Thursday 15 October 2026
Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
Thursday 15 October 2026
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...