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Monday 25 May 2026
Weekly news roundup: TSMC faces its first real rivals; Agibot claims 100% success rate in factory deployment
Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026:
Monday 25 May 2026
EGAT pivots into drones to capture US and European defense and commercial demand
Evergreen Aviation Technologies Corporation (EGAT) said it expanded into drone manufacturing to serve growing overseas demand, pursuing customers in the US and shipments to Europe...
Monday 25 May 2026
Global Electronics Policy Council formed to coordinate industry response to tariffs and export controls
The Global Electronics Association announced the formation of the Global Electronics Policy Council on Monday to centralize policy advocacy for the electronics supply chain in response...
Monday 25 May 2026
Column: US summit signals shift to trusted supply chains, reshaping global manufacturing partnerships
At the 2026 SelectUS Investment Summit in Maryland, US officials used the flagship investment forum to outline a national industrial strategy prioritizing supply chain reconstruction...
Monday 25 May 2026
India roundup: India accelerates chip ambitions, but ecosystem gaps remain a key challenge

India is advancing its technology and semiconductor ambitions through new fab projects, packaging...

Sunday 24 May 2026
Micron starts producing most advanced US-made DRAM at Virginia fab, expands domestic memory supply
Micron Technology has begun manufacturing its 1-alpha (1α) DRAM process technology at its factory in Manassas, Virginia, marking what the company described as the most advanced...
Friday 22 May 2026
China's tech grip forces India's renewable energy ambitions into structural dependence on Beijing's battery supply chains
Reliance's pivot from domestic manufacturing to component procurement reveals the geopolitical constraints reshaping India's clean energy transition and raising questions about supply...
Friday 22 May 2026
Amkor expands Arizona semiconductor packaging campus with additional 67 acres

Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through...

Friday 22 May 2026
AMD deepens China packaging alliance with TF-AMD expansion in Suzhou
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics),...
Friday 22 May 2026
Tata's Assam OSAT plant nears production as India expands chip manufacturing ambitions
Tata Group's semiconductor facility in Assam is expected to begin production soon, marking a significant milestone in India's push to build a domestic semiconductor manufacturing industry...
Friday 22 May 2026
US-Japan cooperation could protect Taiwan '99%', defense investors told at Silicon Valley summit
Taiwan's semiconductor industry and the military implications of a potential cross-strait conflict dominated the aerospace and defense track on the second day of the Plug and Play...
Friday 22 May 2026
Lam Research launches PLP Center of Excellence, replacing wafers with panels
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
Thursday 21 May 2026
Tech Forum 2026: Taiwan must design space, not just build it
At DIGITIMES' Tech Forum 2026 this week, Taiwan's top space official delivered a blunt assessment of the island's growing role in the global space economy: Taiwan has become...
Thursday 21 May 2026
Commentary: Trump's Taiwan chip claim tests TSMC's silence
US President Donald Trump, after recently concluding a visit to China, again publicly accused Taiwan of having "stolen our chip industry." This was not the first time he had made such...
Thursday 21 May 2026
AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...