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Tuesday 15 September 2026
Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile...
Tuesday 15 September 2026
Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different...

Tuesday 15 September 2026
OEM/EMS AI servers: August revenue trends, operational outlook

Taiwan's original equipment manufacturer/electronics manufacturing services (OEM/EMS) sector is witnessing a structural split between...

Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

Tuesday 15 September 2026
China's EV boom enters a phase of overcapacity cleanup
Within a relatively short span of time, China has built a formidable EV industry that has proved difficult for any other country to match globally, nurtured by years of industrial...
Tuesday 15 September 2026
HS Hyosung joint venture to invest KRW1.2 trillion in Ulsan silicon anode plant

HS Hyosung Energy Solution Korea, a joint venture formed by South Korea's HS Hyosung Group and Belgian materials leader Umicore, signed...

Tuesday 15 September 2026
Ainos pushes AI Nose into semiconductor front-end manufacturing
Ainos said its second-generation AI Nose has entered commercial deployment at semiconductor fabs, signaling growing interest in chemical sensing for industrial AI. The move highlights...
Tuesday 15 September 2026
AI's next bottleneck may be profitability, not compute, SK chair warns
For years, as the heat surrounding AI continued to build, competitiveness across the industry was largely measured by brute-force computing power. The broader infrastructure race was...
Tuesday 15 September 2026
SiPh shifts optical module bottleneck upstream: from device manufacturing to laser-grade substrate supply

The market value of optical modules used in data centers is projected to grow from US$12.6 billion in 2025 to US$45.4 billion by 2030...

Tuesday 15 September 2026
Robot supply strategies split between US in-house tech and Chinese local ecosystem
As humanoid robots gradually move from laboratory proofs-of-concept and enter industrial manufacturing and commercial service, their underlying motion control and environmental perception...
Tuesday 15 September 2026
Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

As the silicon carbide (SiC) industry shifts from 6-inch to 8-inch wafer manufacturing, leading China-based substrate suppliers are...

Monday 14 September 2026
Taiwan drone maker Twoway breaks into US defense supply chain with Oklahoma procurement deal
Twoway has signed an agency procurement contract with a purchasing delegation from Oklahoma, marking a breakthrough in its defense strategy as it expands North American deployment...
Monday 14 September 2026
Sandisk recruits engineers in Korea as memory talent race heats up

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...

Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...
Monday 14 September 2026
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company...