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Wednesday 14 October 2026
Hua Hong forges strategic alliances with four Chinese chip equipment giants
Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in...
Wednesday 14 October 2026
TOK expands Koriyama photoresist capacity as AI chip demand rises
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
Wednesday 14 October 2026
Applied Materials CEO says AI race hinges on technology and capacity
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Wednesday 14 October 2026
Adani and Jabil plan 50:50 JV to make AI data center hardware in India
A proposed Adani-Jabil venture could boost India's role in the global AI supply chain by adding local manufacturing of servers, racks, and cooling systems. If approved, the tie-up...
Wednesday 14 October 2026
CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
Wednesday 14 October 2026
Pegatron showcases rack-scale AI infrastructure at OCP Global Summit
Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...
Wednesday 14 October 2026
Apple COO visits Foxconn as iPhone Duo production ramps up
Days before preorders open for Apple's first foldable smartphone, the iPhone Duo, Apple Chief Operating Officer Sabih Khan visited China to inspect its supply chain. On October 11,...
Wednesday 14 October 2026
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
Wednesday 14 October 2026
Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects
As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy...
Wednesday 14 October 2026
China's wafer-scale graphene breakthrough brings quantum rectifiers closer to semiconductor integration
Chinese researchers have demonstrated wafer-scale graphene quantum rectifiers that convert weak radio-frequency signals into DC electricity at room temperature without an external...
Wednesday 14 October 2026
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era

The current growth cycle of the semiconductor industry is driven by the demand for logic and memory tied to artificial intelligence (AI), cloud infrastructure, and advanced...

Tuesday 13 October 2026
CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix
China's ChangXin Memory Technologies (CXMT) is raising concerns over the future pricing power of Samsung Electronics, SK Hynix, and Micron as its plans for next-generation server DRAM...
Tuesday 13 October 2026
Chenbro unveils AI rack-level solutions at 2026 OCP Summit

Chenbro, a leading professional server chassis manufacturer, announced today its participation in the OCP Global Summit 2026, taking place from October 13 to 15 in San...

Tuesday 13 October 2026
Samsung sends yield engineers to Texas ahead of 2nm production ramp
Samsung Electronics has begun dispatching advanced-process yield engineers from South Korea to its Taylor, Texas, foundry ahead of planned 2nm chip volume production in 2027, South...
Tuesday 13 October 2026
Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030
China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate the adoption of locally developed wafer fabrication tools,...