CONNECT WITH US
NEWS TAGGED WAFER
Monday 5 October 2026
TSMC, Intel named as Musk's Terafab ambitions face reality check
As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent, prompting Musk to enter talks with industry mainstays like Intel...
Monday 5 October 2026
ESMT 3Q26 revenue jumps 58%, sets another record
Elite Semiconductor Microelectronics Technology (ESMT) reported September consolidated revenue of NT$7.461 billion (approx. US$234 million), up 470.23% from NT$1.308 billion a year...
Monday 5 October 2026
TSMC emerges as potential Terafab partner as suppliers see over 80% chance of Musk deal
Days after reports emerged that TSMC was reassessing plans for a wafer fab in Texas, Tim Culpan, a former Bloomberg columnist and founder of independent media outlet Culpium,...
Monday 5 October 2026
Applied Materials, Besi broaden packaging partnership for AI chip integration
Applied Materials and BE Semiconductor Industries (Besi) are expanding their partnership to address the increasingly complex connections between AI chips, extending joint development...
Monday 5 October 2026
Nanya Tech expands 3D OSAT to chase HBM-like demand
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
Friday 2 October 2026
ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform
ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly...
Friday 2 October 2026
Nanya Technology wins approval for Southern 3D packaging plant
The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's...
Wednesday 30 September 2026
NSIG chair exit brings leadership succession into focus
National Silicon Industry Group (NSIG) chairman Haitao Jiang has resigned from all positions at the company, prompting the Shanghai-listed semiconductor materials supplier to begin...
Wednesday 30 September 2026
VSMC bets on value over cost as Singapore fab builds next-generation R&D and IP capabilities
VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, opened its 12-inch wafer fab in...
Wednesday 30 September 2026
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
Wednesday 30 September 2026
Foundry 2.0 revenue hits record as growth spreads beyond TSMC
Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
Wednesday 30 September 2026
Tesla secures US$30B credit package to fuel AI and robot capex race
Tesla disclosed on September 29 that it has arranged US$30 billion in new loans and credit facilities as it ramps up investment in AI and robotics, according to a regulatory filing...
Wednesday 30 September 2026
CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.
Wednesday 30 September 2026
Inside China's 3D DRAM push: from lab to fab, and the road ahead
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
Tuesday 29 September 2026
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...