China Steel Chemical Corporation (CSCC)recently developed 5N-grade high-purity carbon powder and graphite crucibles that have been adopted by Taiwanese compound semiconductor firms...
Market experts have noted a trend towards IDM dominance in the GaN semiconductor market, exemplified by Infineon's acquisition of GaN Systems and major power semiconductor firms expanding...
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Taiwan-based ODMs and contract device manufacturers including Hon Hai Technology Group (Foxconn), Quanta Computer, and Wistron have high expectations for AI server sales this year.
Taiwan-based Visco Vision, a specialist in contact lenses and a subsidiary of polarizer maker BenQ Materials, anticipates a surge in revenues for 2024, buoyed by strong support from...
Intelligent Epitaxy Technology Inc (IntelliEPI), a leading provider of epitaxy service for compound semiconductors like Indium Phosphide (InP), Gallium Arsenide (GaAs), and...
The shipping industry, passenger or cargo, has slowly recovered to pre-COVID-19 levels. It is worth noting that since air cargo capacities were booked up by e-commerce demand, failing...
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
The worldwide IC design industry is stable, however, there is a notable increase in wafer foundry manufacturing capacity, which may provide potential risks, according to foundry sources.
Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
China's semiconductor market is being hit by a host of problems, such as overcapacity, with a bumpy ride likely lying ahead throughout 2024, according to industry sources.
TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which...
