CONNECT WITH US
NEWS TAGGED GOLD BUMPING
Wednesday 11 August 2021
ChipMOS sees lucrative memory backend prospect for 2H21
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
Wednesday 17 January 2018
ChipMOS lands orders from new clients for gold bumping services
Taiwan-based IC packager ChipMOS is expected to see its revenue growth significantly driven by the combination of its gold bumping with COF packaging services in 2018, as the company...
Friday 24 November 2017
ChipMOS Shanghai to grab backend orders for China homegrown 3D NAND chips
ChipMOS Technologies (Shanghai), of which Tsinghua Unigroup is a major stakeholder, is expected to secure backend orders for 3D NAND flash chips developed by Yangtze River Storage...
Friday 25 August 2017
Chipbond, ChipMOS see rising orders for TDDI chips
Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...
Wednesday 19 July 2017
Chipbond, ChipMOS seeing robust gold bumping demand
Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...
Wednesday 24 May 2017
ChipMOS reportedly lands gold bumping orders for AMOLED driver ICs from Samsung
ChipMOS Technologies reportedly has landed orders from Samsung Electronics for providing gold bumping services on 12-inch wafers fabricated to produce AMOLED driver ICs to be used...
Monday 26 December 2016
Chipbond grabs new gold bumping orders for power amplifiers, says report
Packaging and testing house Chipbond Technology reportedly has landed new orders for gold bumping for power amplifier (PA) components from Japan- and US-based vendors, according to...
Wednesday 29 July 2015
Chipbond to boost sales from non-driver ICs, says report
Chipbond Technology, which provides backend services mainly for LCD driver ICs, will see significant growth in sales from its non-driver IC product line in the second half of 2015,...
Thursday 18 April 2013
ChipMOS sees orders for NAND flash, driver ICs pick up
ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, has seen orders for NAND flash memory and small-size panel driver ICs pick...
Tuesday 11 September 2012
Chipbond 12-inch gold bumping lines to operate at full capacity in September
LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...
Tuesday 21 August 2012
Chipbond 3Q12 sales driven by demand for small-size panel driver ICs
Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...
Friday 29 June 2012
Chipbond gold bumping capacity booked for iPhones, says report
Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...
Monday 4 June 2012
Chipbond lands 8-inch gold bumping orders from Samsung, says paper
LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...
Tuesday 3 January 2012
Chipbond, ChipMOS develop alternative to gold bumping
Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...
Tuesday 4 October 2011
Chipbond responds to reports of price reductions
Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...