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178 news items tagged Chipbond

  • Second-quarter sales at Chipbond Technology and ChipMOS Technologies, two major driver IC packaging and testing houses, are set to register 10% sequential growth driven by brisk demand...
  • Chipbond Technology is optimistic about the business prospects for 2012, according to the LCD driver IC packaging and testing specialist. The firm added it would continue to build...
  • Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...
  • Driver IC packaging testing service provider Chipbond Technology has obtained orders for COG (chip on glass) chips used in screens for a new version of the iPhone, and 8-inch gold...
  • LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...
  • LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...
  • LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...
  • SPIL
    LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...
  • With China adjusting upward its import tariffs for 32-inch and larger LCD panels, the country's self-sufficiency for panels targeted mainly at TVs is expected to rise significantly...
  • Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...
  • LCD driver IC packaging and testing specialist Chipbond Technology is expected to see its consolidated revenues increase as much as 5% sequentially in the first quarter of 2012, beating...
  • Some Taiwan-based LCD driver IC design houses, in order to spread risks, have placed orders for 8-inch bumping packaging and testing services with South Korea- and Japan-based providers,...
  • Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...
  • Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...
  • Chipbond launches share buyback program

    Thursday 3 November 2011
    LCD driver IC packaging and testing house Chipbond Technology has announced plans to repurchase 10 million, or 1.68%, of the company's outstanding shares, at between NT$22 (US$0.73)...
  • Chipbond Technology, which provides backend services to LCD driver IC suppliers such as Japan's Renesas Electronics, Taiwan-based Novatek Microelectronics and ILi Technology (Ilitek),...
  • Chipbond 3Q11 profit rises on forex gain

    Wednesday 26 October 2011
    Driver-IC packaging and testing house Chipbond Technology has announced financial figures for the third quarter of 2011 with net profits hiking almost 80% sequentially, as recent...
  • Vanguard International Semiconductor (VIS), a major LCD driver IC foundry service provider, and driver-IC packaging and testing specialist Chipbond Technology both saw their third-quarter...
  • Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...
  • Chipbond 2Q11 profits halved

    Wednesday 24 August 2011
    LCD driver IC packaging and testing firm Chipbond Technology has reported net income of NT$254 million (US$8.7 million) on revenues of NT$3.445 billion for the second quarter of 2011...
  • LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies, in view of stagnant demand for LCD panels, expect their revenues for the third quarter of...
  • Chipbond conservative about 3Q11

    Wednesday 13 July 2011
    LCD driver IC packaging and testing firm Chipbond Technology has expressed uncertainty about the outlook for the third quarter due to low order visibility.
  • The market of large-size LCD panels have been improving recently. LCD driver IC packaging and testing firm Chipbond Technology has stated the possibility of a better second quarter...
  • LCD driver IC packaging and testing firm Chipbond Technology has remained cautious about the outlook for the second quarter due to low order visibility. The company expects to report...
  • Demand for LCD driver ICs used in PC monitors has not picked up as was originally expected, according to industry sources. Meanwhile, that for driver ICs from the LCD TV sector remains...
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