Passive, PCB, other IC components

6419 news items tagged Passive, PCB, other IC components

  • wafer
    IC foundries, and PC and handset manufacturers continue to encounter rising costs of components and materials, and will see their gross margins come under downward pressure in 2018,...
  • Taiwan-based Taiflex Scientific, which supplies flexible copper clad laminates and PV module backsheets, has reported net profits for the first quarter of 2018 fell 39.8% sequentially...
  • Taiwan makers of MLCCs will stand to benefit from Japan-based Murata Manufacturing's move to drop the production of general-type MLCCs before the end of fiscal 2020 to allow more...
  • Taiwan-based leadframe suppliers including Shuen Der Industry (SDI) and Jih Lin Technology are moving to expand their production capacities to satisfy growing demand for automotive...
  • passive+components
    Increasingly serious shortfalls in the supply of passive components have disrupted production at some major EMS firms in Taiwan, undermining their shipments to brand clients, with...
  • The world's leading semiconductor suppliers have significantly increased their combined market share over the past decade. According to IC Insights, the top-5 semiconductor suppliers...
  • Taiwan-based diode makers have seen clear order visibility through the third quarter of 2018 while still facing tight supply of silicon epitaxial wafers, according to industry sour...
  • Yageo March revenues surge 80%

    Tuesday 10 April 2018
    Passive component maker Yageo has reported consolidated revenues for March 2018 surged 32.8% sequentially and 80.1% from a year earlier to a record high of NT$4.27 billion (US$146.2...
  • General Integration Technology (GIT), a 3D printing and scanning hardware/software sales agent under the Aurora Group, has become a sales agent for Israel-based 3D printing developer...
  • Taiwan-based leadframe suppliers plan to raise their prices 10-15% in the second quarter of 2018 to reflect tight supply, according to sources at IC backend houses.
  • Intelligent Epitaxy Technology (IntelliEPI), which supplies epi-wafers to the electronics and optoelectronics industries, is expected to see its overall production capacity expand...
  • apple
    Taiwan-based Visual Photonics Epitaxy's (VPEC) VCSEL epi wafers are still pending validation by Apple, and joining the VCSEL 3D sensor supply chain for iPhones and other Apple consumer...
  • Dow expands Asia CMP center

    Wednesday 28 March 2018
    Dow Electronic Materials, a business unit of DowDuPont's specialty products division, held recently a ribbon-cutting ceremony for its phase-four expansion at its Asia CMP Manufacturing...
  • Major IC packaging and testing players are actively developing an advanced fan-out panel level packaging (FOPLP) technology that can package chips on panels larger than 8-inch or...
  • The price hikes and supply shortfall of silicone materials are not expected to ease by the end of the third quarter of 2018. This, coupled with growing penetration of the materials...
  • IC packaging material and tool distributor Niching Industrial saw its gross margin reach a record high of 23% in the fourth quarter of 2017. Gross margin for all of 2017 climbed to...
  • Major MLCC firms are set to raise their quotes by 40-50% with the new prices to be effective from April 1, according to industry sources. The price rally may have limited impact on...
  • Taiwan-based GEM Services, a backend house dedicated to MOSEFET chips and power modules, plans to expand monthly production capacity at its plant in Hefei, China by 30-50% to better...
  • The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...
  • Episil upbeat about 2018

    Friday 23 March 2018
    Taiwan-based Episil Holdings, which makes silicon epitaxial wafers and provides foundry services at its 5- and 6-inch wafer fabs, expects to return to profitability in 2018 thanks...
  • Lite-On Semiconductor's board of directors has approved plans to distribute a cash dividend per share of NT$1.60 (US$0.06) for 2017 when it reported NT$1.80 in EPS.
  • Passive+components+in+increasingly+tight+supply++
    Taiwan suppliers of passive components and their downstream clients have shown divided views over when the lingering supply shortfalls and price hikes would ease. Though downstream...
  • Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
  • Metal-alloy chassis maker Catcher Technology has announced plans to subscribe to new shares of PCB firm Career Technology for NT$38 (US$1.30) each or a total of about NT$1.13 billi...
  • ShunSin swings to profit in 4Q17

    Friday 16 March 2018
    ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, returned to profitability...
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