936 news items tagged packaging and testing
STATS ChipPAC performing below expectations, says report
Thursday 21 July 2016The performance of STATS ChipPAC still has been lower than expected in recent quarters following its acquisition by China-based Jiangsu Changjiang Electronics Technology for US$780...
Chip equipment spending to stay flat in 2016, says SEMI
Wednesday 13 July 2016The worldwide semiconductor equipment market will register about flat growth in 2016, but is expected to rebound in 2017, according to SEMI.
ASE posts flat 2Q16 revenues
Friday 8 July 2016Advanced Semiconductor Engineering (ASE) saw its consolidated revenues increase only 0.4% sequentially in the second quarter of 2016, while sales generated from its core IC ATM (assembly...
Amkor opens MEMS packaging line in China
Monday 4 July 2016Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology has announced it is ramping up a new MEMS and sensor packaging line...
ASE, SPIL sign merger deal
Friday 1 July 2016Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) jointly announced on June 30 they have officially entered into a merger agreement reached on May...
ASE expects merger with SPIL to create synergies
Thursday 30 June 2016Advanced Semiconductor Engineering (ASE) expects its merger with Siliconware Precision Industries (SPIL) to create synergies, and both companies will be able to derive considerable...
ASE seeing better sales in 2H16
Tuesday 28 June 2016Advanced Semiconductor Engineering (ASE) expects to post sequential revenue growth through the fourth quarter of 2016, according to company COO Tien Wu. Revenues for the second half...
ASE, SPIL vow to execute joint share-swap deal
Monday 27 June 2016Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) now expect to start the execution of a joint share-exchange MoU reached between the two companies...
PTI says minimal impact from power outage at Xian plant
Tuesday 21 June 2016Packaging and testing company Powertech Technology (PTI) said in a filing with the Taiwan Stock Exchange (TSE) that a power supply disruption at its Xian, China plant will not have...
ASE May revenues fall on year
Tuesday 7 June 2016Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$20.6 billion (US$638.8 million) for May 2016, up 1.9% sequentially but down 11.8% on year.
SPIL reports increased May revenues
Tuesday 7 June 2016Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$7.46 billion (US$231 million) for May 2016, up 9.3% sequentially and 0.7% on year.
PTI May revenues increase
Tuesday 7 June 2016Packaging and testing company Powertech Technology (PTI) has reported consolidated revenues of NT$3.8 billion (US$117.6 million) for May 2016, up 5.2% sequentially and 10.7% on yea...
Chipbond to post higher profits in 2Q16, says report
Monday 30 May 2016LCD driver IC packaging and testing house Chipbond Technology is expected to post higher profits with revenues rising 7-10% sequentially in the second quarter of 2016, according to...
Digitimes Research: Merger brings more competitiveness to ASE, SPIL
Monday 30 May 2016Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have agreed to merge through the formation of a parent holding company, which would allow both...
ASE, SPIL agree to set up JV holding company
Friday 27 May 2016Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reached an agreement to establish a holding company, which will own both ASE and SPIL.
ASE, SPIL halt trading pending release of material information
Wednesday 25 May 2016Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both announced they will enter a trading halt on May 26, pending the release of material...
Walton announces stock buyback
Monday 23 May 2016Memory-IC packaging and testing house Walton Advanced Engineering has announced plans to repurchase as many as five million shares at prices between NT$8 (US$0.25) and NT$12 per share...
ChipMOS secures NT$13.2 billion syndicated loan
Monday 16 May 2016ChipMOS Technologies has signed a five-year syndicated loan for NT$13.2 billion (US$404.5 million) with 10 local banks in Taiwan, according to the packaging and testing company.
ASE posts decreased April revenues
Monday 9 May 2016Consolidated revenues at Advanced Semiconductor Engineering (ASE), which consist of sales generated by EMS subsidiary Universal Scientific Industrial (USI), fell 14.1% sequentially...
SPIL April revenues down on-year
Thursday 5 May 2016Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$6.83 billion (US$210.6 million) for April 2016, down 1.9% on year but up 6.3% on month.
Invensas signs BVA technology license and development agreement with ASE
Tuesday 3 May 2016Tessera Technologies has announced that its wholly-owned subsidiary Invensas signed a new technology license and development agreement with Advanced Semiconductor Engineering (ASE)...
SiP demand stays weak in 2Q16, says ASE
Tuesday 3 May 2016Advanced Semiconductor Engineering's core IC ATM (assembly, test and material) business has seen a pick-up in demand in the second quarter of 2016, but demand for SiP (system-in-package)...
ASE 1Q16 profits fall 7%
Friday 29 April 2016IC packager Advanced Semiconductor Engineering (ASE) has announced net profits of NT$4.16 billion (US$129.1million) for the first quarter of 2016, down 7% on year and 17% sequentia...
SPIL expects higher factory utilization in 2Q16
Friday 29 April 2016Siliconware Precision Industries' (SPIL) capacity utilization rate for the second quarter of 2016 will rise from the first quarter, with some of its production lines, mainly those...
SPIL 1Q16 profits shrink 38.6% in 1Q16
Thursday 28 April 2016IC packager Siliconware Precision Industries (SPIL) has reported net profits of NT$1.6 billion (US$49.7 million) for the first quarter of 2016, down 38.6% from a year earlier.
- ASE receives ISO 26262 certification standard (Oct 6) - Company release
- Jiangsu Changjiang Electronics' shares to halt trading pending restructuring (Nov 27) - Reuters
- TSMC: Curb your enthusiasm on InFO, says Goldman (Nov 17) - Barron's
- Fitch: More M&A likely in semiconductor backend industry (Sep 28) - Reuters
- SPIL: Will Foxconn tie-up help steal ASE's Apple business? (Aug 31) - Barron's
- Wafer-level packaging not enough, say OSATS - EE Times
- STATS ChipPAC takeover talks extended a second time (Dec 21) - The Straits Times
- Stats ChipPac chalks up 27% rise in Q1 profit to US$4.3 million (April 24) - The Straits Times
- Renesas to transfer backend facilities to J-Devices (March 19) - Company release
- Amkor 3Q12 sales miss guidance (October 25) - Company release