One of the world's three major machine tool shows, Japan's International Machine Tool Fair (JIMTOF 2026), opened this week, with 94 Taiwan companies exhibiting. The exhibitors are...
As military conflict in the Middle East cripples global energy infrastructure, the United States is emerging as the critical anchor for the world's high-tech manufacturing sector....
Meta has become the first of the four major US hyperscale cloud providers to report its latest earnings, with supply chain players closely monitoring changes in the company's capital...
TSMC is scouting Texas for possible new US capacity, even as it builds out its advanced-process fabs in Arizona. Chairman C.C. Wei confirmed that a team has been sent to Texas to assess...
PCB makers are expanding sustainability efforts as artificial intelligence (AI) and high-performance computing (HPC) drive demand for higher-performance boards. Still, the industry...
Apple has raised its iPhone Duo shipment target by 44%, from 9.7 million to 14 million units over 12 months, as strong consumer demand for its first foldable iPhone prompts the company...
Rapid growth in AI-driven demand is placing new pressure on the printed circuit board (PCB) supply chain, with equipment constraints, shorter product...
Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...
The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron,...
As Taiwan and the US deepen supply chain localization efforts, concrete plans for Taiwan's electrical and electronics industries to establish US industrial parks are rapidly taking...
Taiwanese passive-component maker Holy Stone has entered the supply chain of a major South Korean automaker after about two years of market expansion, prompting the company to raise...
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
As geopolitical tensions reshape global supply chains, US regulations governing energy and battery energy storage systems (BESS) are undergoing rapid and unpredictable changes.
Major Chinese energy storage system suppliers that once dominated the US market have reportedly withdrawn almost entirely from US operations in 2026, amid mounting regulatory restrictions,...
