Hanwha E-ssential, a subsidiary of Hanwha Solutions, has successfully localized the production of semiconductor packaging insulation materials in South Korea. The company plans to...
China's SiC industry, once viewed as a critical front in global tech rivalry, has been transformed over the past two years. Breakthroughs in domestic SiC materials and mass production...
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
Wolfspeed's recovery from bankruptcy protection remains uncertain, with core problems expected to extend beyond its anticipated year-end exit. The US power semiconductor firm is struggling...
On August 28, Niching presented strong growth prospects at its latest investor conference, highlighting the AI-driven opportunities for cooling solutions. The company's improved product...
Traditional glass manufacturer Taiwan Glass has invested its resources in AI fiberglass cloth, successfully transforming and penetrating the AI server supply chain led by Nvidia to...
Intel is reportedly preparing to license its glass core substrate (GCS) technology, reversing course from its earlier plan to commercialize the technology in-house. The pivot could...
Phison Electronics announced consolidated revenue of NT$5.688 billion (approx. US$191 million) for July 2025, representing a 21% increase compared to July 2024 and setting a new high...
Memory IC design house AP Memory reported a net loss for the second quarter of 2025, due to approximately NT$980 million (US$32.7 million) in foreign exchange losses caused by the...
As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
Nvidia is reportedly preparing to enter a new phase in the memory market by planning to deploy between 600,000 and 800,000 SOCAMM modules in 2025. This initiative positions SOCAMM...
Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
As artificial intelligence continues to accelerate the adoption of advanced semiconductor packaging, Taiwan-based materials supplier Niching is riding a wave of momentum. The company...
