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    Meta globally rolls out Meta One subscription, expands to Taiwan
    12min ago
    Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle
    14min ago
    China's FAW to become GAC's second-largest shareholder as auto consolidation talk returns
    Sep 15, 19:08
    Column: China tightens rare earth controls, and Taiwan must guard supply chain flexibility
    Sep 15, 19:08
    China’s wafer fabs boost local equipment buying, pressuring South Korean suppliers
    Sep 15, 19:08
    NEWS TAGGED PRESIDENT
    Wednesday 16 September 2026
    DeepSeek to hire its first CFO as it aims for public listing, expands workforce

    DeepSeek is reportedly set to hire Wentao Yan, a partner at venture capital firm GL Ventures, as its first CFO. If the appointment takes...

    Tuesday 15 September 2026
    Murata considers bigger MLCC expansion as AI server demand extends beyond 2028

    Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing...

    Saturday 12 September 2026
    Taiwan sees AI-era power upgrade openings in France
    Taiwan's power and energy companies are looking to grow their presence in Europe. To support that push, the Chinese International Economic Cooperation Association (CIECA) organized...
    Friday 11 September 2026
    Taiwan tech minister in Europe to advance semiconductor cooperation

    National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe...

    Wednesday 9 September 2026
    Indonesia bets on a full EV supply chain as BYD opens its Subang plant

    Indonesia's industry minister said the country has the resources to build a complete domestic electric vehicle chain, speaking in Subang,...

    Tuesday 8 September 2026
    Acer Asia units post double-digit growth on strong AI orders
    Acer's Asia operations posted double-digit revenue growth at three subsidiaries in the first half of 2026, led by Altos Computing, Acerpure, and Highpoint Service Network. Altos is...
    Saturday 5 September 2026
    Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race
    "Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as...
    Friday 4 September 2026
    Adobe names Anil Chakravarthy as next chief executive
    Adobe's leadership change signals a broader shift in how major software companies are positioning themselves for an AI-driven market. The move may affect customers, partners, and investors...
    Friday 4 September 2026
    Electroninks, Merck, Qualipoly build advanced packaging ecosystem
    Electroninks, a global provider of metal-composite conductive inks and advanced semiconductor packaging materials, has formed a strategic partnership with Merck and Taiwan-based Qualipoly...
    Tuesday 1 September 2026
    Apple reshuffles leadership, shifts Schiller out of App Store
    Apple has made another major management shake-up. After Tim Cook stepped down as CEO and was succeeded by John Ternus, formerly head of hardware engineering, veteran Phil Schiller...
    Tuesday 1 September 2026
    China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics
    Wuhan Xinxin Semiconductor Manufacturing Company (XMC) has laid out a 10-year expansion strategy centered on 3D integration, silicon photonics (SiPh), and specialty processes, targeting...
    Monday 31 August 2026
    ASE: CPO scale-out demands deeper supply-chain coordination for mass production
    SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
    Friday 28 August 2026
    Update: ABF substrate maker Unimicron searched in origin-labeling probe
    (The latest status of the probe as of August 29th is updated below.)
    Friday 28 August 2026
    Samsung eyes zHBM products from 2029 as heat remains key hurdle
    Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
    Friday 28 August 2026
    Lam Research breaks ground on Oregon lab expansion for AI chip development
    Lam Research has begun work on a new Oregon research lab as part of a more than US$3 billion global investment aimed at speeding development of advanced AI chips. The expansion could...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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