The IC substrate sector is predicted to return to growth in the second half of 2024, with the growth momentum continuing in 2025, according to industry sources.

Unimicron Technology's production yield rates for high-end ABF substrates remain lower than those of Ibiden. This presents a challenge to the Taiwanese company, despite being the...

BT substrate demand has begun to rise, driven by growing demand for mobile phones and memory chips, while ABF substrate demand is expected to pick up in the second half of 2024, according...

The ABF substrate industry is in a quandary.

The advancement of AI application is driving significant developments in the essential materials for PCB and HDI, with Taiwan's leading trio in Copper Clad Laminate (CCL) —...

In response to its mid-term expansion strategy, Unimicron Technology has upped its capex goal for this year by NT$6.9 billion (US$218.8 million) to NT$24.2 billion, a nearly 40% increase,...

Following a significant drop in sales of BT substrates and midrange ABF substrates in 2023 amid sluggish post-pandemic consumer electronics demand, Taiwan's Unimicron Technology is...

ABF substrate prices are unlikely to reach their previous high in 2024 but should have already reached their low point, according to industry sources.

The weak end demand since the second half of 2022 has affected the ABF substrate capacity utilization rate of the four major Taiwanese substrate manufacturers: Unimicron, Nanya PCB,...

A surge in AI server demand will help related PCB vendors recover from setbacks they encountered in 2023, according to industry sources.

Industry suppliers are generally optimistic about Ajinomoto Build-up Film (ABF) substrate market prospects for 2024 and 2025, citing the recovery of the PC market, a growing demand...

The September revenue performances of the top three Taiwanese substrate manufacturers have been revealed along with their third-quarter revenues. Despite operations not seeing as...

Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...

At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...

The Taiwan Printed Circuit Association (TPCA) and the Thailand Trade and Economic Office (TTEO) recently jointly held the inaugural "Thai Student PCB Job Fair" aiming to help Taiwanese...