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Friday 11 November 2022
Tokyo Electron cuts outlook on US chip curbs, memory slump
Key chip equipment supplier Tokyo Electron Ltd. slashed its full-year outlook after memory makers cut spending and the US ramped up restrictions on cutting-edge chip-gear exports...
Thursday 15 September 2022
Semiconductor firms TSMC and TEL go all out to get talent
As semiconductor companies are busy building new fabs in Asia and also in Europe and the US, talent shortage is becoming a big headache. How desperate are semiconductor companies...
Thursday 15 September 2022
Tokyo Electron advanced patterning technologies for EUV lithography address yield and environmental impacts
In 2022, as global inflation has been revised up and with the threats of the conflict in Eastern Europe, the world economy is facing an increasingly challenging and uncertain outlook...
Thursday 7 July 2022
Asia IC50: TEL CEO Kawai achieves mid-term goals before schedule and remains optimistic over future growth
Tokyo Electron (TEL), Asia's largest semiconductor equipment manufacturer, is also the world's third-largest. It not only enjoyed extraordinary growth in 2021, and achieved record...
Friday 18 February 2022
Fab toolmakers on track to gain big from bold TSMC capex plans
Fab toolmakers worldwide are all poised to score significant revenue gains in 2022 and beyond from fulfilling robust orders from TSMC, which is set to invest over US$100 billion during...
Tuesday 28 December 2021
Tokyo Electron highlights environmentally friendly solutions
Driven by leading edge investment, global semiconductor equipment billings increased 38% year-over-year to US$26.8 billion in the third quarter of 2021, and an 8% rise from the prior...
Friday 26 November 2021
Equipment maker ACM debuts on China STAR market
ACM Research, a supplier of wafer cleaning technologies for advanced semiconductor devices, has had its Shanghai-based subsidiary start trading on the science and technology innovation...
Tuesday 23 November 2021
TSMC ecosystem partners see bright prospects ahead
TSMC's ecosystem partners, particularly equipment makers, are poised to embrace strong growth momentum, as the foundry will be expanding its fab capacities over the next three years,...
Friday 6 August 2021
Foxconn gears up for automotive power IC boom
Foxconn (Hon Hai) Technology Group, through its NT$2.52 billion (US$90.67 million) acquisition of Macronix International's 6-inch wafer fab and equipment, will be able to meet a market...
Thursday 1 July 2021
Six-inch fabs become acquisition target
Six-inch wafer fabs have become acquisition targets of automotive power semiconductor companies, as well as Foxconn Electronics (Hon Hai Precision Industry) and Tesla, both of which...
Wednesday 9 June 2021
Tokyo Electron to collaborate with imec-ASML joint high NA lab
Tokyo Electron has announced the company will introduce its leading-edge Coater/Developer to the imec-ASML joint high NA EUV research laboratory (joint high NA lab) in Veldhoven,...
Tuesday 30 March 2021
Chipmaking equipment and materials suppliers looking to beef up operations in Taiwan
Japan-based semiconductor equipment vendor Tokyo Electron is reportedly eyeing the acquisition of a 6-inch wafer fab in Taiwan that has been put up on sale, while fellow companies...
Tuesday 22 December 2020
Major IC equipment, materials vendors deepening presence in Taiwan
Many international semiconductor equipment and materials suppliers have been stepping up investments or strengthening deployments in Taiwan seeking to better serve TSMC's ecosystem...
Monday 2 November 2020
MediaTek announces chipmaking equipment purchases
Mobile SoC specialist MediaTek has announced over NT$1 billion (US$35 million) worth of fab tools that the fabless chipmaker will spend for its chip production.
Tuesday 29 September 2020
Providing diverse and complete solutions, TEL continues to break through advanced semiconductor process technology
In addition to process technology which enhances the performance of semiconductor devices by scaling, 3D and heterogeneous integration has led to the development of various new structures...