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    ASML 3Q25 revenue driven by TSMC and China amid tariff impact easing
    9h 50min ago
    Taiwan leads global AI adoption with Google Cloud's Gemini Enterprise platform
    9h 54min ago
    Apex secures NT$200 million orders for 2025 for optoelectronics business
    9h 56min ago
    DBC plans to boost in-house electronic material capacity by more than six-fold
    10h 1min ago
    EU tightens PHEV carbon emission rules, prompting 4Q25 sales surge among local automakers
    10h 6min ago
    Chinese companies push for over 50% adoption of domestic chips
    10h 8min ago
    NEWS TAGGED SIC
    Wednesday 8 October 2025
    China and Taiwan chart diverging paths in the 12-Inch SiC market
    In the high-stakes arena of silicon carbide (SiC) innovation, a quiet transformation is underway. While much attention has focused on non-Chinese supply chains entering advanced packaging...
    Wednesday 8 October 2025
    India approves NaMo Semiconductor Lab at IIT Bhubaneswar
    Union Minister for Electronics and Information Technology Ashwini Vaishnaw has approved the establishment of the NaMo Semiconductor Laboratory at the Indian Institute of Technology...
    Tuesday 7 October 2025
    China's SiC industry finds high-value exit in Meta's AR supply chain

    As the global semiconductor industry eyes the rise of 12-inch silicon carbide (SiC) wafers as potential game-changers in advanced packaging,...

    Monday 6 October 2025
    Mitsubishi Electric opens SiC plant amid cooling EV market
    Mitsubishi Electric held a completion ceremony on October 1, 2025, for its new power semiconductor factory in Kumamoto Prefecture, Japan. The facility will produce silicon carbide...
    Thursday 2 October 2025
    CoWoS creates turning point for 12-inch SiC
    Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
    Wednesday 1 October 2025
    Japan's Nichia taps Taiwanese executive for top post as part of semiconductor push
    Japanese LED leader Nichia has promoted Taiwan-born executive Tsun-Chia Tai to senior managing director, a move effective October 1 that makes him the highest-ranking Taiwanese manager...
    Wednesday 1 October 2025
    China's 12-inch SiC leap: SICC, Jingsheng in spotlight
    The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...
    Tuesday 30 September 2025
    Non-China supply chain pushes 12-inch SiC into advanced packaging, but China stands to gain
    The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is...
    Saturday 27 September 2025
    Infineon, Rohm sign MOU to support flexible SiC power device shipments
    Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate...
    Tuesday 23 September 2025
    12-inch SiC substrates poised for two-phase entry onto CoWoS packaging
    After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...
    Tuesday 23 September 2025
    Episil bets on SiC and GaN for Q4 rebound as compound semiconductor market bottoms out

    Episil and its epitaxy-focused subsidiary Episil Precision, spanning both silicon (Si) and wide-bandgap semiconductors such as silicon...

    Sunday 21 September 2025
    Huawei patents SiC cooling tech to power next-gen AI chips
    Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
    Sunday 21 September 2025
    Non-China market opportunities remain despite no involvement in advanced packaging, say Episil and EPI
    The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...
    Saturday 20 September 2025
    TSMC, Largan, Episil push back on hype with blunt market outlooks
    SiC applications recently gained attention following reports that TSMC and Nvidia are pushing for advancements, elevating companies like Episil and its subsidiary EPI into the market...
    Friday 19 September 2025
    Samsung, Wolfspeed escalate silicon carbide race as EV and AI demand climbs
    Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry.
    1/36 pages
    SpecialReports
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
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