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Tuesday 21 April 2026
Samsung scales MRAM to 8nm, setting 5nm showdown with TSMC in 2027
Samsung is accelerating its push into magnetoresistive random-access memory (MRAM), positioning the technology as a strategic pillar alongside DRAM and high-bandwidth memory (HBM)...
Tuesday 21 April 2026
China amping up DRAM integration: GigaDevice expands into DRAM through CXMT tie-up
GigaDevice is moving into DRAM through a KRW1 trillion (US$680 million) related-party deal, combining CXMT's manufacturing capacity with its own sales network in a move that could...
Tuesday 21 April 2026
End of Cook era underscores Apple's growing dependence on ecosystem strength over breakthrough products
As Tim Cook prepares to transition from CEO to executive chairman on September 1, 2026, analysts and industry observers are reviewing a 15-year tenure defined by unprecedented financial...
Tuesday 21 April 2026
APAC advances CPO positioning: ELSFP beings small-volume shipments, in-house COC line set for 3Q26 completion
Optical communications company APAC Opto Electronics reported that its inventory digestion phase is nearing completion, with market demand showing a clear rebound. Looking ahead to...
Tuesday 21 April 2026
Foxconn Industrial Internet to mass-produce CPO all-optical switches in 3Q26 with over 10,000 units target
Brand Cheng, chairman of Foxconn Industrial Internet (FII), a cloud networking business under Foxconn, recently announced ongoing advancements in technologies, including co-packaged...
Monday 20 April 2026
Analysis: How TSMC avoids memory's boom-and-bust cycle
Ahead of TSMC's earnings call, DIGITIMES senior analyst Luke Lin explained that TSMC typically does not revise its full-year revenue forecast or capital expenditure during...
Monday 20 April 2026
AI chip rivalry escalates: ABF substrate sells out for Unimicron, Kinsus, Nan Ya PCB
AI GPUs, CPUs, and ASICs are driving demand for increasingly larger sizes and higher layer counts in substrate technology. The supply-demand gap for high-end ABF substrates continues...
Monday 20 April 2026
AI boom lifts Taiwan's chip testing firms to record 1Q26
As artificial intelligence chips increasingly migrate to advanced manufacturing nodes, the complexity — and duration — of semiconductor testing is rising sharply. That...
Monday 20 April 2026
Naura revenue climbs on China chip tool demand, margins tighten amid rising costs and competition
China semiconductor equipment maker Naura Technology delivered strong 2025 revenue growth on rising chip tool demand and domestic substitution, but weaker margins and intensifying...
Monday 20 April 2026
South Korea's DeepX moves DX-M1 AI chip into mass production; builds up inventory to address supply constraints
South Korean AI semiconductor startup DeepX has entered mass production and supply for its in-house neural processing unit (NPU), the DX-M1, as it seeks to scale revenue amid tightening...
Monday 20 April 2026
Chinese conglomerate makes entry into memory sector as AI drive structural shift
On April 17, Security Times reported that Beijing New Space-time Technology (Time Space Technology) plans to acquire Shenzhen-based memory module maker Powev Electronic Technology...
Monday 20 April 2026
Brands boost wearable device sales to offset smartphone shipment pressure
Rising prices for key upstream components such as memory have dampened global smartphone shipments, prompting brands to boost memory inventory, raise the share of mid- to high-end...
Monday 20 April 2026
Cerebras revives IPO bid as AI boom fuels growth and high-profile partnerships

Cerebras Systems has renewed its push to go public, filing for an initial public offering (IPO) after shelving an earlier attempt amid regulatory...

Monday 20 April 2026
MSP+ eyes 2026 growth with new Yangmei plant, advances in Micro LED and CPO
Micraft System Plus (MSP+), a supplier of mass transfer and laser technology equipment, will officially open its new Yangmei factory in northern Taiwan in May 2026, significantly boosting...