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Monday 6 July 2026
LandMark Optoelectronics posts record revenue in June, expands for post-2028 growth

LandMark Optoelectronics (LMOC) posted record-high single-month revenue in June 2026 and is stepping up its expansion plans to prepare...

Monday 6 July 2026
Greatek Electronics advances Taiwan+1 plan with acquisition of Onsemi Philippines packaging plant
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging...
Monday 6 July 2026
China's chip equipment makers ramp up expansion as AI and memory boom fuel domestic demand

China's leading semiconductor equipment manufacturers are accelerating expansion through acquisitions and fundraising, as surging AI...

Monday 6 July 2026
Exclusive: AWS's ASIC shipment hike drives demand upside for Taiwan suppliers

Amazon Web Services has told its server supply chain partners to raise shipment volumes for the third quarter of 2026, according to...

Monday 6 July 2026
AI supercycle could drive semiconductor market beyond US$2 trillion by 2030
The global semiconductor market is entering a historically significant growth phase. According to WSTS's latest June forecast, global semiconductor revenue is projected to grow by...
Sunday 5 July 2026
AI PCs, AR glasses, and robots reshape display tech

The rapid expansion of AI applications is redefining what device makers need from display technology.

Sunday 5 July 2026
AI, HPC test interface demand drives CHPT June revenue to new monthly high

Test interface supplier Chunghwa Precision Test Tech. Co., Ltd. (CHPT) reported its June 2026 revenue, marking its sixth consecutive...

Saturday 4 July 2026
Machvision's June revenue hits another record due to AI demand
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for...
Friday 3 July 2026
Turn Cloud shifts to AI infrastructure

Turn Cloud Technology is accelerating its transformation from a solution as a service (SolaaS) provider into an AI infrastructure provider...

Friday 3 July 2026
BOE targets AI packaging with Micro LED optical interconnect and glass substrate CPO

BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...

Friday 3 July 2026
Exclusive: Chinese automakers pursue overseas production to shape future vehicle standards
China's automakers are pushing more aggressively into overseas manufacturing as electric vehicle (EV) growth meets weaker margins, tougher competition, and rising trade barriers. The...
Friday 3 July 2026
SAP names Verena Siow Asia-Pacific President

Enterprise software company SAP announced on July 2 that it has appointed Verena Siow as president of the Asia-Pacific (APAC) region,...

Friday 3 July 2026
AI server PMIC demand drives spillover orders for Taiwan chip designers

Taiwanese power management IC (PMIC) design houses have been expanding into new applications and broadening their product portfolios...

Friday 3 July 2026
Volkswagen gives China joint venture control of exports as auto strategy shifts
Volkswagen has handed full export-market control to its China joint venture, marking a major shift in how the German automaker uses its Chinese operations. The move, unveiled at an...
Friday 3 July 2026
Turvo expands auto business and targets growth in five new markets
Turvo Technology said on July 2 that it is expanding beyond automotive parts into healthcare, semiconductors, and robotics, a move that may interest global manufacturers and investors...