As Micro LED applications gain traction, PlayNitride is set for robust growth in the latter half of 2024. August marked a milestone with a record revenue of NT$184 million (US$5.89...
Padget Electronics, a subsidiary of India-based Dixon Technologies, has signed an MoU with HP to manufacture notebooks, PCs, and all-in-one PCs as part of India's initiative to encourage...
Increasing silicon carbide (SiC) substrate supply from China at lower prices is expected to fuel Taiwan-based foundry houses' diversification into compound semiconductors.
Elna Printed Circuits, a subsidiary of PCB manufacturer Global Brands Manufacture (GBM) under Walsin Technology Group, has inaugurated a new PCB facility in Penang, Malaysia.
Although the semiconductor industry is in a supercycle due to AI, factories of Samsung Electronics (Samsung) and SK Hynix may not be able to operate as normal due to staff shortages...
Global Lighting Technologies (GLT), reportedly a major light guide plate supplier for Apple's notebook keyboards, has disclosed plans to construct production capacity in Thailand...
Due to LTPS LCD having advantages such as high resolution, lightweight design, and low power consumption, it will possibly lead the automotive display market in the future.
Huawei's HiSilicon Full-Connection Conference is scheduled for September 9 in Shenzhen, just one day before Apple's annual iPhone launch event. While the timing's intent remains unclear,...
Nvidia's founder and CEO, Jensen Huang, revealed that the Blackwell chip will be mass-produced and delivered to clients in the last quarter of 2024. He also states that demands for...
It has been nearly a year since Huawei HiSilicon's Kirin chipset made its comeback. Observing Huawei's mobile performance this year, signs suggest that the company's supply issues...
US-based xMEMS Labs is set to deliver its newly unveiled XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing MEMS technology,...
In response to robust demand for servers that has resulted in capacity constraints, major DRAM manufacturers have significantly increased the prices of DDR5 memory in the third quarter,...
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
