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Tuesday 14 October 2025
OCP Summit: Supermicro says soaring GPU power demands are forcing shift to rack-scale AI standardization
The explosive rise in AI computing power is pushing the data center industry to rethink its entire architectural model, according to Vik Malyala, senior vice president for technology...
Tuesday 14 October 2025
Beyond the rack: how OCP is wiring the world for AI
The Open Compute Project (OCP) Global Summit, held at the San Jose Convention Center, drew a record crowd of more than 11,000 participants, underscoring the event's growing importance...
Tuesday 14 October 2025
OCP Summit: Meta and Oracle adopt Nvidia Spectrum-X Ethernet to scale open AI data-center networks
Ian Buck, Nvidia's Vice President of hyperscale and high-performance computing, presented a keynote titled "Shaping the Future of Open Infrastructure for AI" at the 2025 OCP Global...
Friday 10 October 2025
SEMICON West 2025: Chip leaders urge policy stability to counter China
At the geopolitics forum of SEMICON West 2025, corporate government affairs executives from Arm Holdings, ASML, Entegris, Intel, and Lam Research all presented policy recommendations...
Tuesday 7 October 2025
Commentary: Leadership shakeup at HP challenges Taiwan's PC supply chain to adapt
Global PC giant Hewlett-Packard (HP), the world's second-largest PC brand, is undergoing a major leadership upheaval that has sent ripples through its extensive Taiwan supply chain...
Tuesday 7 October 2025
Advantech partners with Edge Impulse to integrate AI tools into edge computing platforms
Advantech announced on October 3, 2025, a strategic partnership with Silicon Valley-based Edge Impulse, an edge AI development platform under Qualcomm. The collaboration integrates...
Thursday 2 October 2025
Arm appoints Michael H. Wong to lead Taiwan business; CK Tseng shifts to North America
Arm announced on October 1 that Michael H. Wong has been appointed as the new president of Arm Taiwan, effective immediately. Wong will lead the Taiwan sales team to deepen collaboration...
Thursday 2 October 2025
InPsytech hires Arm veteran David Hsu as COO
Egis Technology Group's silicon intellectual property (IP) vendor InPsytech announced on October 1 that it has appointed industry veteran David Hsu—Arm's former FAE director—as...
Wednesday 1 October 2025
Japan's Nichia taps Taiwanese executive for top post as part of semiconductor push
Japanese LED leader Nichia has promoted Taiwan-born executive Tsun-Chia Tai to senior managing director, a move effective October 1 that makes him the highest-ranking Taiwanese manager...
Wednesday 1 October 2025
SEMI chief: Taiwan-India synergy to shape semiconductor future
Ajit Manocha, president and CEO of Semiconductor Equipment and Materials International (SEMI), underscored Taiwan's role as a central innovation hub in the global semiconductor eco...
Thursday 25 September 2025
TSMC reshuffles Arizona leadership as executive succession accelerates
TSMC announced on September 25 that Y.L. Wang has resigned from his role as director and CEO of TSMC Arizona Corporation, effective October 1. Wang's departure marks the completion...
Thursday 25 September 2025
C.C. Wei meets ex-TSMC chiefs in new elite network driving Taiwan's chip dominance

A new network of former TSMC executives and senior staff, officially named the TSMC Fellowship of Honor, has been launched to strengthen...

Thursday 25 September 2025
GlobalFoundries teams with Zensemi on 40nm tech for China's auto chip market
GlobalFoundries (GF), the world's fifth-largest foundry, unveiled its latest strategy for the China market at a technology summit held in Shanghai on September 24, 2025. The company...
Tuesday 23 September 2025
Oracle appoints co-CEOs; Catz moves to vice chair role
On September 22, Oracle announced that Clay Magouyrk and Mike Sicilia have been appointed CEOs, succeeding Safra Catz, who will transition to Executive Vice Chair of the company's...
Monday 22 September 2025
MediaTek unveils Dimensity 9500 with dual-core NPU architecture for major performance leap
MediaTek has officially launched its new smartphone system-on-chip (SoC), the Dimensity 9500. Built on TSMC's advanced N3P process technology, it currently offers the best balance...