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    TI(com)
    Sponsored
    ASEH likely to raise 2024 capex; US production line possible
    6h 58min ago
    AI PCs to boost QLC NAND SSD adoption, says Micron
    7h 11min ago
    Merck exec sees microLED development potential in Taiwan
    7h 18min ago
    New BYD NEV to adopt Horizon Robotics chip
    9h 20min ago
    Australian IC design house opens Taipei office
    9h 28min ago
    Intel collaborates with ecosystem partners to accelerate liquid cooling solution maturity
    9h 35min ago
    LGD eyeing return to profitability
    9h 47min ago
    Qualcomm sees procurement from major US PC brand ramp up
    9h 57min ago
    ASEH expects core backend biz to post growth in 2Q24
    10h 54min ago
    Micron granted US$6.1 billion in US subsidies
    11h 4min ago
    NEWS TAGGED OPEN NAND FLASH INTERFACE
    Tuesday 10 November 2020
    Micron ships 176-layer 3D NAND flash memory
    Micron Technology has begun volume shipments of what the company claims is the world's first 176-layer 3D NAND flash memory.
    megawin
    BIZ FOCUS
    Apr 25, 09:37
    SK Hynix announces 1Q24 financial results
    Wednesday 24 April 2024
    Automate 2024: Cincoze to display AI edge computing solutions
    Thursday 18 April 2024
    Connections Summit 2024 gathers RFID industry to discuss market trends, technical developments and future use cases for technology
    Thursday 18 April 2024
    GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
    Summary of Tech Supply Chain News!
    RESEARCH INSIGHTS
    Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
    Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
    Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research