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Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
Tuesday 21 July 2026
CMTX develops 590mm single-crystal silicon ground ring for chip etching

South Korean semiconductor materials and parts supplier CMTX has developed a roughly 590mm single-crystal silicon ground ring for chip-etching...

Wednesday 3 June 2026
Delta Electronics unveils prefabricated AI modular data center that cuts deployment time by 60%
Delta Electronics said at COMPUTEX 2026 that it has launched a prefabricated AI modular data center designed to speed deployment of AI infrastructure by cutting IT build time by about...
Sunday 19 April 2026
ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries
AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
Wednesday 25 February 2026
Unitree launches As2 quadruped robot with longer range, higher payload and all-weather capability
Chinese robotics firm Unitree Robotics unveiled its latest quadruped robot, the Unitree As2, on February 24, 2026, positioning the new model as a more capable platform for industrial...
Thursday 5 February 2026
Skytech delivers self-made PLP equipment, eyes record 2026 growth
As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...
Friday 19 December 2025
Huawei returns to Taiwan tablet market, targets Apple with eye-care tech
Huawei has returned to Taiwan's tablet market with a clear point of differentiation: eye protection. Unveiled on December 17, 2025, the MatePad 11.5 (2025) targets growing tablet demand...
Tuesday 7 October 2025
Huawei overtakes Apple, topping global smartwatch market
Huawei smartwatches have recently seen a steady rise in sales in the Japanese market, particularly favored by middle-aged and elderly consumers. Retail channels indicate that since...
Thursday 18 September 2025
CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Monday 8 September 2025
Skytech secures orders for self-developed PLP equipment as OSAT firms adopt CoPoS
Following TSMC's confirmation in February 2025 that it will include 310×310 mm panels in its chip-on-panel-on-substrate (CoPoS) mass production, supply chain players—including...
Tuesday 26 August 2025
Samsung Display expected to remain key supplier for rumored foldable iPhone
Apple's long-rumored foldable iPhone is taking shape as Samsung Display, DS Neolux, and BH reportedly secure roles in its supply chain. Backed by Samsung Display's exclusive panel...
Friday 15 August 2025
Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...