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NEWS TAGGED MEMS
Monday 27 May 2019
PSI rules out China for new wafer processing fab site
Taiwan-based Phoenix Silicon International (PSI), dedicated to wafer reclaim, wafer thinning and MEMS mid-end process services, plans to set up a new plant to fulfill robust orders...
Wednesday 20 February 2019
MEMS environment sensing hub under development for diverse applications
Along with rampant IoT development, MEMS-based sensing solutions will be increasingly applied to diverse segments such as smartphones, wearable electronics devices, and automotive...
Thursday 14 February 2019
200mm fabs to add 700,000 wafers through 2022, says SEMI
Robust demand for more content for mobile, Internet of Things (IoT), automotive and industrial applications will drive production of 700,000 200mm wafers from 2019 to 2022, a 14%...
Friday 1 February 2019
VIS expects up to 13% revenue decrease in 1Q19
Specialty IC foundry Vanguard International Semiconductor (VIS) expects to post a revenue decrease of 8-13% sequentially in the first quarter of 2019, citing inventory adjustments...
Friday 30 November 2018
Backend firm Lingsen optimistic about demand for MEMS
Lingsen Precision Industries has expressed optimism about demand for MEMS including ambient light sensors (ALS), proximity sensors and MEMS microphones. The backend firm expects packaging...
Tuesday 2 October 2018
Silead starts under-display fingerprint sensor R&D
China-based fingerprint sensor supplier Silead has been engaged in the development of under-glass MEMS-based ultrasonic solutions, and expects to enter volume production of the under-display...
Friday 10 August 2018
IC distributors WT Micro, Edom to see robust growths in 3Q18
IC distributors WT Microelectronics and Edom Technology are both expected to enjoy robust sequential revenue growths in the third quarter driven mainly by a pick-up in chip demand...
Tuesday 10 July 2018
Robust MOSFET demand drives PSI revenue growth
Strong MOSFET demand boosted revenues at Phoenix Silicon International (PSI), which provides wafer thinning services, in June.
Wednesday 20 June 2018
Xintec halts 12-inch wafer-level packaging production
Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...
Thursday 14 June 2018
PSI expanding wafer thinning business
Phoenix Silicon International (PSI), which specializes in wafer reclaim services, expects steady growth in its wafer thinning business in 2018. The product segment has expanded to...
Friday 8 June 2018
PSI reportedly grabs orders for industrial MOSFETs from Infineon
Phoenix Silicon International (PSI) has been contracted by a number of Europe- and US-based IDMs, such as Infineon, to use wafer thinning for making industrial MOSFET chips, according...
Monday 4 June 2018
Taiwan 2nd-tier backend firms enjoy pick-up of orders
Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...
Friday 1 June 2018
Backend firm Lingsen sales to peak in 3Q
Taiwan-based backend service company Lingsen Precision Industries is expected to see its sales climb to their peak for 2018 in the third quarter driven by robust demand for MEMS sensors,...
Friday 25 May 2018
Backend firms to gain from strong demand for MEMS sensors
Taiwan-based backend houses are expected to significantly benefit from increasingly brisk market demand for MEMS sensors for use in smartphones and other consumer electronics devices,...
Monday 14 May 2018
CHPT eyes revenue gain from MEMS vertical probe cards in 2018
Taiwan-based wafer test solution provider Chunghwa Precision Test Tech (CHPT) is expected to see the revenue ratio for its MEMS-based vertical probe cards (VPCs) surge to a double-digit...