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NEWS TAGGED EDGE COMPUTING
Tuesday 6 April 2021
Arm-based server solutions to expand presence in edge computing market
Arm is expanding its presence in the edge computing server market as its server solutions' lower power consumption and costs are giving the chip designer competitiveness.
Thursday 25 March 2021
Alliance formed in Taiwan to promote 5G smart pole standards
A total of 25 companies in Taiwan have newly formed a 5G Smart Pole Standard Promotion Alliance, aiming to draft technological standards and tap huge smart-city business opportunities...
Tuesday 16 March 2021
IC and material distributors to embrace strong 2Q21
Taiwan-based distributors of ICs and materials continue to see strong influx of orders, which will buoy their sales performance through the second quarter, according to industry so...
Friday 12 March 2021
AltumView Systems uses edge computing to detect gait changes in older adults while protecting privacy
The world is aging. Taiwan is set to become super-aged by 2025 with one in five citizens being 65 or older. It is growingly important that an aging society bring can concepts and...
Tuesday 9 March 2021
With 5G driving AI at the edge, ADLINK expects IoV and smart factory to forge ahead
5G achieves a 20Gbps downlink peak data rate (20 times faster than 4G), a latency as low as 1ms (one tenth of 4G) and a connection density of one million devices per square kilometer...
Tuesday 2 March 2021
Arm pushing into HPC and datacenter markets, says Digitimes Research
With its advantages in edge computing and mobile device applications, Arm has been expanding its server solution offerings, heading towards high performance computing instead of staying...
Friday 26 February 2021
Wistron, Chunghwa Telecom team up to tap 5G, AI service sectors
Wistron Group has forged a strategic alliance with Chunghwa Telecom (CHT) to jointly tap business opportunities arising from proliferating 5G and AI applications.
Friday 5 February 2021
Wire-bonding capacity to stay short of demand throughout 2021
ASE Technology Holding will see its wire-bonding capacity run at full utilization and remain short of demand through the end of 2021, and up to 90% of clients have signed two-year...
Wednesday 20 January 2021
Taiwan server makers eyeing double-digit increases for 2021 shipments
Taiwan-based server makers including Quanta Computer, Inventec, Wiwynn, Mitac Computing Technology and Foxconn Technology are optimistic about their business prospects this year with...
Monday 18 January 2021
Dell optimistic about emerging technology development in 2021, says company CTO
Dell is optimistic about the development of quantum technologies, heterogeneous architecture of semiconductors, 5G and edge computing in 2021, according to company CTO John Roese.
Wednesday 13 January 2021
Gowin embeds Winbond 64Mb HyperRAM to GoAI 2.0
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb...
Tuesday 15 December 2020
Chipmakers to ramp up 176-layer 3D NAND chip output in 2H21
Chipmakers including Micron Technology and SK Hynix have introduced the availability of their 176-layer 3D NAND flash chips, and are expected to ramp up the chip output for UFS and...
Thursday 10 December 2020
Taiwan IT players gearing up for 5G enterprise network business
Taiwan's IT and network equipment makers are gearing up to explore new business opportunities for 5G enterprise network solutions, particularly in the Japan market, where demand for...
Tuesday 10 November 2020
Micron ships 176-layer 3D NAND flash memory
Micron Technology has begun volume shipments of what the company claims is the world's first 176-layer 3D NAND flash memory.
Thursday 5 November 2020
Zhen Ding enters high-frequency rigid PCB line via acquiring BoardTek
Taiwan's PCB leader Zhen Ding Technology has completed its acquisition of local peer BoardTek Electronics as a wholly-owned subsidiary, which specializes in high-frequency rigid boards...