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NEWS TAGGED COPPER
Friday 6 July 2018
Taiflex sees FCCL demand pick up
Taiflex Scientific saw a pick-up in demand for flexible copper clad laminate (FCCL) in June, with its electronic materials business unit posting revenues of NT$780 million (US$25.6...
Wednesday 4 July 2018
Taiwan PCB firms fined for environmental infractions in China
PCB manufacturers Ichia Technologies and Career Technology have both been fined for violating environmental regulations in China.
Friday 29 June 2018
Copper foil firm LCY starts trading on TWSE mainboard
LCY Technology, which produces and sells copper foil products, started trading on the mainboard of the Taiwan Stock Exchange (TWSE) on June 28. It started trading at NT$24.80 (US$2.17),...
Friday 15 June 2018
Ventec to apply for listing on TWSE mainboard
Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...
Wednesday 13 June 2018
Copper foil maker Co-Tech to focus more on niche-market applications
Co-Tech Copper Foil expects to focus more on high-value, niche-market applications for the company's long-term growth.
Friday 8 June 2018
Applied Materials breakthrough accelerates chip performance in big data and AI era
Applied Materials has announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.
Thursday 31 May 2018
Taiflex optimistic about flexible PCB market
Taiwan-based Taiflex Scientific, which supplies flexible copper clad laminates (FCCL), expects the flexible PCB (FPCB) market to continue growing.
Friday 20 April 2018
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...
Wednesday 18 April 2018
FCCL maker Taiflex 1Q18 net profits fall
Taiwan-based Taiflex Scientific, which supplies flexible copper clad laminates and PV module backsheets, has reported net profits for the first quarter of 2018 fell 39.8% sequentially...
Thursday 28 December 2017
Aveni extends copper interconnects to 5nm and below for BEOL integration
Aveni, a developer and manufacturer of wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, has announced it has obtained results...
Thursday 31 August 2017
IC material supplier Wahlee obtains dry-film photoresist orders
Semiconductor material distributor Wahlee Industrial has obtained dry-film photoresist orders from Taiwan-based PCB firms for the production of substrate-like PCBs (SLP), according...
Wednesday 23 August 2017
Copper foil maker Co-Tech net profits hit record for 4th consecutive quarter
Rising copper foil prices continued to buoy Co-Tech Copper Foil's profitability in the second quarter of 2017, which hit a record high for the fourth consecutive quarter.
Monday 3 July 2017
Credo partnering with Foxconn to deliver 10M 100G active copper cable solutions
Credo Semiconductor, a developer of serializer-deserializer (SerDes) circuits, technology and IP cores, and Foxconn Interconnect Technology, a supplier of interconnect solutions,...
Monday 5 June 2017
Faraday announces automotive ASIC qualified for AEC-Q100 and AEC-Q006
Taiwan-based Faraday Technology has announced an automotive ASIC device qualified for AEC-Q100 and AEC-Q006 as defined by the Automotive Electronics Council (AEC).
Tuesday 25 April 2017
Copper foil maker Co-Tech positive about 2017 outlook
Co-Tech Copper Foil has expressed optimism about its performance during 2017 citing robust copper foil demand.