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Thursday 24 September 2026
Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...
Thursday 24 September 2026
Xi-Trump summit masks AI rift as Chinese AI leaders stay away
Chinese President Xi Jinping is set to make his first state visit to the US since 2015, with the Trump administration rolling out high-level welcoming ceremonies, a state dinner and...
Thursday 24 September 2026
Qualcomm pushes Snapdragon PCs further into Linux, GoogleBook as AI shifts to the device edge

Qualcomm used the second day of its Snapdragon Summit 2026 to underline a broader shift for Snapdragon-powered PCs, announcing Linux...

Thursday 24 September 2026
TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...

Thursday 24 September 2026
Eternal Materials eyes 2H26 peak season as precision equipment, advanced packaging shipments rise
Eternal Materials reported unaudited earnings before taxes (EBT) of NT$269 million (approx. US$8.47 million) in August 2026, up 28.05% from August 2025, with pre-tax earnings per share...
Thursday 24 September 2026
Qualcomm bets on earphones as the voice gateway for personal AI
Qualcomm used its keynote on the second day of Snapdragon Summit 2026 to argue that earphones, glasses, and other wearables will shape the next phase of AI computing. For global consumers...
Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...
Thursday 24 September 2026
Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap
Alibaba has formally unveiled its self-developed Zhenwu V900 AI chip at the 2026 Apsara Conference, with CEO Eddie Wu describing the T-Head Semiconductor-designed processor as "China's...
Thursday 24 September 2026
Qualcomm's PickNik deal brings robotics software to its edge AI push
MoveIt's integration with Qualcomm's Dragonwing and Arduino platforms could give robot builders a more direct route from on-device AI to motion planning and control, while also testing...
Thursday 24 September 2026
Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus
Ahead of the Trump-Xi summit, the key semiconductor question is no longer simply how much Nvidia hardware Washington will allow China to buy.
Thursday 24 September 2026
Powertech targets quarterly growth in 2026, eyes record high

Powertech Technology expects stronger memory packaging and testing demand, higher average selling prices (ASPs), and ramping high-end...

Thursday 24 September 2026
SK Hynix Indiana HBM plant faces lawsuit

SK Hynix's high-bandwidth memory (HBM) production site under construction in Indiana has been drawn into local litigation as the race...

Thursday 24 September 2026
OUCC sees semiconductor chemical shipments ramping up in 2027
Oriental Union Chemical Corporation (OUCC) expects shipments of semiconductor chemicals to ramp up in 2027 as more products complete customer qualification, with the Taiwan-based chemical...
Thursday 24 September 2026
LSTC links with Rapidus to revive Japan's advanced chipmaking

Japan's Leading-edge Semiconductor Technology Center (LSTC) is building a public-private-academic framework around Rapidus, which plans...

Wednesday 23 September 2026
SKC raises Absolics stake to 82% as glass substrates remain in testing
SKC is increasing its investment in its US glass substrate subsidiary Absolics, raising its stake to more than 82%, as the South Korean materials group commits more capital to a business...