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NEWS TAGGED CHINA GOVERNMENT
Wednesday 26 July 2017
Taiwan IC design service and IP firms land AI chip orders from China
Taiwan-based IC design service companies and silicon IP providers have started to land orders for artificial intelligence (AI) applications from China's IC industry and academia,...
Monday 17 July 2017
Globalfoundries and VeriSilicon to enable single-chip solution for next-gen IoT networks
Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...
Friday 14 July 2017
Notebook vendors increase adoption of mixed material chassis in 2H17
Notebook brand vendors including Dell and Hewlett-Packard (HP) reportedly will increase their adoption of notebook chassis made of mixed materials in the second half as China has...
Monday 10 July 2017
NSIG hires former MEMC CEO
China's National Silicon Industry Group (NSIG) has hired Nabeel Gareeb, former CEO of MEMC Electronic Materials, to help it establish a materials eco-system in China.
Wednesday 28 June 2017
Imec looking to deepen partnerships with China-based chipmakers
China has the possibility to become a world-class semiconductor industry if local players make good use of resources domestically and internationally, according to Huiwen Ding, head...
Tuesday 27 June 2017
IST strikes deal with JFE-TEC to jointly provide automotive-use materials testing services in China
Integrated Service Technology (IST), a Taiwan-based provider of electronics product verification and analysis services, has signed an MoU with Japan's JFE Techno Research (JFE-TEC),...
Tuesday 13 June 2017
Toppan welcomes partnership with China firms
Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...
Wednesday 29 March 2017
Tsinghua Unigroup to obtain more funds from government
Tsinghua Unigroup on March 28 announced it had signed a deal with the China Development Bank (CDB), under which the bank will provide Tsinghua Unigroup with CNY100 billion (US$14.5...
Wednesday 15 March 2017
HLMC 12-inch fab running at full capacity, says company VP
China-based 12-inch wafer foundry Shanghai Huali Microelectronics (HLMC) has seen its Fab 1 run at full capacity with order visibility extended to the second half of 2017, according...
Thursday 2 February 2017
China MIC 2025 results for ICs likely to fall short of its goals, says IC Insights
China's government has a long-term goal to become self-sufficient with regards to IC devices. Its "Made in China 2025" (MIC 2025) plan was published by the China State Council...
Thursday 12 January 2017
Tsinghua Unigroup planning three new wafer plants with investment totaling US$70 billion
China's Tsinghua Unigroup is looking to build IC manufacturing sites in Wuhan, Chengdu and Nanjing with total investment reaching US$70 billion, according to Zhao Weiguo, chairman...
Tuesday 13 December 2016
Commentary: Silicon wafer industry headed for consolidation
With Siltronic reportedly drawing interest from China's state-backed industry group, the global silicon wafer industry is expected to go through a period of consolidation in 2017.
Monday 14 November 2016
Three major China firms gearing up to enter DRAM market
Yangtze River Storage Technology (YRST), Fujian Jin Hua Integrated Circuit, and a joint venture set up by GigaDevice Semiconductor and the Hefei city government of China's Anhui province,...
Wednesday 26 October 2016
China a growing threat in mature technologies, says TSMC chairman
China-based foundries have been fast expanding their production capacity for 28nm and more mature process technologies which could pose a threat to Taiwan Semiconductor Manufacturing...
Thursday 6 October 2016
VR players pushing into China market
As demand for VR-related experiences continues to grow and the China government has been aggressively pushing establishment of VR industry alliances, players including High Tech Computer...