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NEWS TAGGED CCI
Wednesday 19 September 2018
Cooling module firms see server demand accelerate
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics have seen demand from the server sector accelerate since the beginning of second-half...
Friday 14 September 2018
Smartphone vendors looking for new thermal management solutions for 5G phones
While preparing to launch 5G-enabled smartphones in the first half of 2019, most major handset vendors are reportedly seeking new thermal management solutions in response to heat...
Tuesday 4 July 2017
CCI expects rising demand in 2H17, says paper
Cooling module maker Chaun-Choung Technology (CCI) expects its products for servers and notebooks to enjoy strong demand in the second half because of seasonality. Second-half revenues...
Wednesday 9 November 2016
CCI revenues rise, but profits drop in 3Q16
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) has announced third-quarter consolidated revenues of NT$1.86 billion (US$58.86 million), up 3.04% sequentially, but...
Wednesday 16 March 2016
Chaun-Choung attains over 90% yield rates for all product lines
Heat-sink pipe and thermal module maker Chaun-Choung Technology has increased yield rates for all product lines to more than 90% by using automation equipment, the company said at...
Friday 31 July 2015
Notebook component makers shift to server applications along with ODMs
While notebook ODMs, such as Quanta Computer and Compal Electronics, have been expanding staff specifically for servers used in cloud computing data centers, their component suppliers,...
Tuesday 26 August 2014
Component makers take measures to prevent gross margins from dropping
With notebook vendors becoming more aggressive in releasing low-price notebooks and leaning toward adopting cheaper components for these devices, components makers have started taking...
Monday 21 April 2014
Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%
Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...
Thursday 12 December 2013
CCI steps into marketing non-notebook heat-sink devices
Chaun-Choung Technology (CCI) has extended development and production from heat-dissipation pipes and thermal modules for use in notebooks to those for use in servers, smartphones,...
Monday 17 June 2013
First-tier players may release smartphones that adopt heat pipes by the end of the year
Smartphone players such as Apple, Samsung Electronics and High Tech Computer (HTC) have started showing interest in adopting ultra-thin heat pipes for their smartphones and are expected...
Monday 28 January 2013
CCI sees strong vapor chamber shipments in 2012
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) is estimated to have shipped about five million vapor chambers in 2012, up significantly from about two million units...
Monday 21 January 2013
Cooling module makers to benefit from smartphone and tablet orders in 2013
Cooling module makers, which used to mainly focus on supplying notebook products, are expected to benefit from orders from smartphone and tablet products in the second quarter of...
Thursday 3 January 2013
Demand for thermal modules used in convertible notebooks increasing
As Windows 8 has stimulated increasing demand for convertible notebooks, orders for related thermal modules are expected to be on the rise, according to Taiwan-based thermal module...
Tuesday 15 February 2011
High copper price damaging profitability of notebook component makers
Taiwan-based makers of notebook components such as connector, cable, power supply and cooling modules are seeing their profitability drop as the recent global copper price is hovering...
Wednesday 15 December 2010
Auras, Chaun Choung hope to reflect impact of currency exchange on pricing for notebook thermal modules
Auras Technology and Chaun Choung Technology, two Taiwan-based makers of thermal modules, are developing new models for use in notebooks to be launched in the first quarter of 2011...