In an era of unprecedented data growth driven by devices ranging from notebooks to AI servers, the demand for high-speed data transmission at both the equipment and user ends continues...
MicroLED chip specialist PlayNitride is investigating obtaining strategic investment from downstream partners in order to raise funds for capacity development, according to the Taiwan-based...
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...
Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm fabs as the industry reaches a record high of...
The Taiwan Printed Circuit Association (TPCA) and the Thailand Trade and Economic Office (TTEO) recently jointly held the inaugural "Thai Student PCB Job Fair" aiming to help Taiwanese...
Given the global trend towards net-zero emissions and the ongoing implementation of carbon tax mechanisms, how to more effectively utilize power has become one of the most critical...
Infineon Technologies is expanding its production capacity to meet the rising demand for semiconductors used in electric vehicles (EV) and other automotive applications over the next...
Against modest demand for compound semiconductors used in mobile phone power amplifiers (PA), there is still stable demand for defense and other niche applications, and Taiwan's major...
Specialty IC foundry Vanguard International Semiconductor (VIS) has reported net profits surged 46.3% sequentially to nearly NT$2 billion (US$63.2 million) in the second quarter of...
Flexible PCB specialist Flexium Interconnect, during its investor meeting on July 27, pointed out that the company will focus on maintaining its profitability in the second half and...
BYD is set to expand its silicon carbide (SiC) epitaxy capacity by 50% in 2023 and has already begun installing equipment with the production lines to be fully completed by September...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
European IDMs differ slightly from their US counterparts in terms of manufacturing capacity deployments, focusing more on expanding wafer fab capacity than backend packaging and testing...
