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Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED C SUN
Thursday 3 March 2022
PCB equipment makers poised for thriving sales in 2022
Taiwan's PCB equipment makers are poised to embrace another prosperous year in 2022, as their full capacity utilization will persist through at least the end of the third quarter,...
Friday 26 November 2021
PCB and IC substrate equipment makers see order visibility extended to 2H22
Taiwan-based equipment suppliers engaged in the PCB and IC substrate sectors have seen order visibility extended to the second half of next year, thanks to their clients increasing...
Wednesday 20 October 2021
Taiwan PCB equipment suppliers busy fulfilling orders
With PCB and IC substrate suppliers looking to expand capacity, related equipment suppliers will be busy fulfilling orders that will be ramping up substantially through 2022, according...
Friday 23 April 2021
GP, C Sun introduce miniLED equipment
Group Up Industrial (GP) and C Sun, eyeing fast growing demand for miniLED backlighting, have introduced corresponding manufacturing equipment, according to industry sources.
Tuesday 6 April 2021
PCB equipment makers bolstered by capacity expansions at clients
Taiwan's PCB equipment makers have seen their shipment schedules well set through the third quarter of the year and are in talks with clients about equipment orders for fourth-quarter...
Friday 27 November 2020
C Sun expects advanced IC packaging equipment to drive growth
Manufacturing equipment supplier C Sun expects equipment used in advanced IC packaging, mainly SiP (system in package), FO-WLP (fan-out wafer-level package) and CoWoS (chip-on-wafer-on-substrate),...
Thursday 12 November 2020
Equipment makers see rising revenue proportions from semiconductor sector
Manufacturing equipment makers have seen rising contributions to revenues from wafer foundry and IC packaging/testing service providers.
Wednesday 28 October 2020
C Sun aims to raise revenue proportion for IC packaging equipment in 2021
C Sun aims to increase the proportion of consolidated revenues for advanced IC packaging equipment to 30% in 2021, according to company chairman Morris Liang.
Friday 23 October 2020
Equipment makers to gain from ABF substrate capacity expansions
Taiwan-based equipment makers including Csun Manufacturing and Gallant Precision Machining (GPM) expect strong demand from domestic IC substrates makers now all gearing up to build...
Monday 12 October 2020
PCB equipment makers see bright growth prospects ahead
Taiwan's PCB equipment makers including C Sun and Symtek Automation Asia are poised to embrace strong growth momentum as many PCB and IC substrate makers are keenly expanding capacities...
Thursday 27 February 2020
PCB equipment makers see unclear order visibility amid outbreak
The coronavirus outbreak is expected to prompt PCB makers to accelerate their production automation to cope with the worsening labor shortages, but PCB equipment makers still see...
Friday 22 February 2019
PCBECI equipment networking pilot team formed in Taiwan
A PCBECI equipment networking pilot team, organized by Taiwan Printed Circuit Association (TPCA), has kicked off operation seeking to boost network connectivity of Taiwan-made PCB...
Monday 19 November 2018
LCD equipment makers see order visibility extend to 2019
Most Taiwan-based LCD equipment suppliers have seen their order visibility extend to 2019 as a number of advanced LCD plants are ready to start moving in equipment in the coming year...
Friday 18 April 2014
C Sun expects LCD, LED equipment to be main source of revenue growth in 1H14
Taiwan-based production equipment maker C Sun expects TFT-LCD and LED equipment to be the main source of growth in its consolidated revenues for the first half of 204, the company...
Wednesday 11 July 2012
C Sun lands PSS turnkey order from China
C Sun, a Taiwan-based maker of PCB, FPD and other types of production equipment, has obtained a turnkey order for PSS (patterned sapphire substrate) production, including equipment,...
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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