News tagged APAC at DIGITIMES

NEWS TAGGED APAC

Friday 14 August 2026

OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...

Friday 14 August 2026

Kioxia eyes customer trials for PCIe Gen6 optical SSD

Kioxia is developing a PCIe Gen6 optical SSD and hopes to work with customers on its next prototype, as the Japanese memory maker tackles...

Friday 14 August 2026

Intel tests system memory to ease AI KV-cache pressure

Intel tests presented at the OCP APAC Summit 2026 that moving the key-value cache used in large language model (LLM) inference from GPU memory to system DRAM can raise serving throughput...

Friday 14 August 2026

Rapidus targets 8-reticle interposers by 2030

Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...

Friday 14 August 2026

Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure

AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.

Thursday 13 August 2026

Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026

OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward

Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.

Thursday 13 August 2026

Lightmatter white paper targets fragmented supply chain, barriers to photonic interconnect deployment

Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, announced at the OCP APAC Summit 2026 that the company has released an infrastructure white paper aimed at building a...

Thursday 13 August 2026

OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory

Intel sees agentic AI changing the balance of AI servers, as CPU orchestration, memory capacity and data movement emerge as performance constraints even when more GPU capacity is a...

Thursday 13 August 2026

Can diamond rewrite the rules of AI chip cooling? Wiwynn is putting it to the test

As AI processors become more powerful, one of the industry's most stubborn constraints is becoming increasingly physical: there is only so much heat conventional materials can move...

Wednesday 12 August 2026

OCP APAC 2026: Google says 48V hits wall as AI racks head toward megawatt scale

Google used its keynote at the OCP APAC Summit in Taipei on August 11 to argue that the 48V power architecture widely used in data centers is running out of headroom as AI racks move...

Wednesday 12 August 2026

OCP APAC 2026: AMD sees AI agents pushing CPU-GPU ratio toward 1:1

AMD expects the shift from chatbots to agentic AI to sharply increase CPU demand alongside GPU acceleration, potentially moving the traditional CPU-to-GPU ratio from roughly 1:4 toward...

Wednesday 12 August 2026

OCP APAC 2026: Cloud AI's growth hits a new bottleneck— networking, not compute

At the 2026 OCP APAC Summit, debate over networking architectures in cloud AI data centers sharpened as industry players said the main...

Wednesday 12 August 2026

OCP APAC 2026: Applied Materials exec calls for hardware co-optimization to solve AI power crisis

Speaking at the OCP APAC Summit in Taipei, Subi Kengeri, Corporate Vice President and General Manager of Systems to Materials at Applied...

Wednesday 12 August 2026

OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout

Microsoft sources roughly 70% of the hardware content in its cloud infrastructure from Taiwan and the wider Asia-Pacific region, executives...

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