At MWC 2023, Qualcomm and MediaTek have seen direct confrontations between their product lines for almost all applications, such as 5G-related communication technologies, AIoT solutions...
Qualcomm and MediaTek will compete to show off their latest IC technologies and SoC solutions for AIoT, satellite communications and Wi-Fi applications, and handset chips at the upcoming...
Despite lackluster consumer market outlook, Taiwan's IC design houses are taking advantage of the global pandemic slowdown to showcase their latest technologies at CES 2023, focusing...
Memory module maker Apacer Technology is teaming up with Industrial PC specialist Adlink Technology to develop rugged-level edge computing solutions for AIoT device applications,...
Mitac Holdings has disclosed plans to set up manufacturing operations in Southeast Asia in 2023, as part of its efforts to increase production resilience and lower the risk of supply...
Industrial PC maker Nexcom International expects demand for automation and smart manufacturing to remain strong in 2023 despite macro headwinds challenging many industry sectors.
Automotive chip IDMs and first-tier components suppliers are set to negotiate capacity supply and manufacturing quotes for 2023 with their foundry partners in Taiwan, but it may not...
High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...
Despite Wi-Fi core chips recently starting to show signs of a slowdown, leading chipmakers like Broadcom, Qualcomm and MediaTek are still in full swing for the deployment of Wi-Fi...
A pick-up in demand starting the second half of 2023 would be the best-case scenario for most ICT players, against deflation as the worst state, according to Peter Chen, chairman...
Taiwan's IC design houses are spending more resources and efforts on developing AI-related applications to strengthen their competitiveness. They are keen on incorporating AI algorithms...
Despite the US' latest restrictions on exports of advanced-node chips and related manufacturing equipment to China, China will still be capable of developing its homegrown AI chips...
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Taiwan's IC design houses including MediaTek, Novatek Microelectronics and Realtek Semiconductor have sharply increased their new development projects for the next 1-2 years despite...
