Several Japanese semiconductor equipment manufacturers are witnessing a surge in sales, particularly in equipment catering to generative AI and power semiconductors. Despite a downturn...
Major Japan-based semiconductor equipment saw their market capitalization more than double in 2023, with other suppliers reporting nearly doubling of their market valuations, highlighting...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Taiwan's OSATs and foundry TSMC that boasts testing capacity have refrained from making the expected purchases of new wafer probers and automated testing equipment (ATE) from major...
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...
Japan is set to officially tighten export controls on 23 semiconductor equipment items to China, starting in July, following the US-led containment against Chinese semiconductor industry...
Japanese semiconductor equipment suppliers Canon, Ulvac, Advantest, and material maker Sumitomo Bakelite are accelerating the R&D of back-end process products. Rapidus, a chip...
Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry...
Semiconductor supply chain players will continue to face relatively high market uncertainty in 2023, and are not expected to embark on a clear growth track until 2024, according to...
AI-based system-level testing (SLT) solutions will be increasingly needed to support new chipsets and modules for server, industrial control and automotive applications, according...
Taiwan-based display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies plan to procure additional high-end testing equipment, mainly from Japan's...
Display driver IC (DDI) backend houses Chipbond Technology and ChipMOS Technologies both plan to raise their quotes by 10-20% later in the first quarter of 2022, according to industry...
OLED display drive IC (DDI) demand for handset and automotive applications is set to grow sharply in 2022 allowing DDI backend specialists ChipMos Technologies and Chipbond Technology...
