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    Smartphone sector braces for uncertainty with US, China steering 2025 growth
    1min ago
    South Korea doubles down on display research as China tightens grip on global market
    10min ago
    Google reportedly explores combining TPU chips with Nvidia GPUs to cut costs and boost data center scaling
    27min ago
    Analysis: Taiwan’s EV price war escalates as Luxgen undercuts Tesla ahead of new launch
    29min ago
    Japan’s 2026 drone budget surges to record-high US$2.13 billion
    32min ago
    Taiwan’s new digital minister pushes software industry to go global with products, not projects
    34min ago
    Taiwan PCB makers brace for mixed 2H25 as tariffs cloud demand
    39min ago
    Samsung and SK Hynix reportedly delay DDR4 phase-out as older chips prove more profitable than DDR5
    42min ago
    Taiwan’s top industrial lab says talent, not just chips, will power the future
    44min ago
    Taiwan’s IPC makers retool for AI image recognition in retail
    48min ago
    China's BAT boosts AI infrastructure spending by 168% in 2Q25
    Sep 4, 18:05
    China's auto dealers hang by a thread amid 1H25 price war
    Sep 4, 18:05
    Ant Group boosts investments in chip startups after IPO setback
    Sep 4, 18:05
    Samsung Electro-Mechanics develops continuous zoom camera module targeting Chinese smartphone market
    Sep 4, 18:03
    South Korean semiconductor equipment maker expands in China despite G2 tensions
    Sep 4, 18:03
    NEWS TAGGED 42DOT
    Monday 5 June 2023
    Hyundai invests in 42dot to establish global software center
    Hyundai Motor took another step forward to transform its vehicles. The automaker injected KRW346.2 billion (US$265.1 million) into the majority-owned self-driving startup, 42dot,...
    Research Report Database
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 3 September 2025
    Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
    Wednesday 3 September 2025
    Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
    Wednesday 3 September 2025
    SK hynix Introduces Industry's First Commercial High NA EUV
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES