Applied Materials has announced its intention to establish a collaborative engineering center in Bangalore, India that will focus on the development and commercialization of semiconductor...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Upon implementation of the European Chips Act, TSMC and Intel are enticed to make substantial investments in Europe, whereas Samsung Electronics maintains a wait-and-see attitude...
Intel and the German federal government have signed a revised letter of intent for Intel's planned leading-edge wafer fabrication site in Magdeburg, the capital of Saxony-Anhalt....
Global 300mm fab equipment spending for front-end facilities next year is expected to begin a growth streak to a US$119 billion record high in 2026, following a decline in 2023, according...
Wafer fab equipment (WFE) manufacturers' revenue increased 9% on year to a record US$120 billion in 2022 despite the macroeconomic slowdown, currency fluctuations, component shortages,...
A German official said the country might not provide additional subsidies for Intel to expand its chipmaking capacity in Europe as opinions among the eurozone's largest economy are...
TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration,...
TSMC has confirmed intentions to establish a joint venture fab in Germany, but aims for a high shareholding to prevent production capacity from being controlled. The Taiwan-based...
Japan has officially announced that it will tighten controls on exports of 23 types of semiconductor equipment to China starting July 23. How the new trade curbs will impact Chinese...
GlobalFoundries and STMicroelectronics have announced the successful conclusion of their agreement to establish a jointly-operated, high-volume semiconductor manufacturing facility...
TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.
The US Department of Defense (DoD), through the Defense Microelectronics Activity (DMEA) Trusted Access Program Office (TAPO), has accredited GlobalFoundries' advanced manufacturing...
United Microelectronics Corp. (UMC) continues to observe customers adjusting inventory levels, albeit at a slower rate than expected, while cyclical shifts in the business climate...