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TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform

Monica Chen, Taipei; Willis Ke, DIGITIMES Asia Thursday 24 September 2020 0

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly unveiled 3D Fabric wafer level system integration technology platform,...

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