Cloud services to disrupt IC design process: Q&A with Microsoft Taiwan GM Ken Sun

Aaron Lee, Taipei; Willis Ke, DIGITIMES Asia Monday 29 October 2018 0

At the Open Innovation Platform (OIP) Ecosystem Forum held in early October, Taiwan Semiconductor Manufacturing Company (TSMC) announced the launch of OIP Virtual Design Environment (OIP VDE) and the formation of OIP Cloud Alliance in cooperation with...

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