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Commentary: Hynix provides Taiwan packaging houses with about 100 million reasons to invest in China

Amy Lee, Hsinchu; Esther Lam, DIGITIMES Asia Monday 3 October 2005 0

Although a jointly-established memory production plant between Hynix Semiconductor and STMicroelectronics may require monthly testing and packaging of 94 million thin small outline package (TSOP) made DRAM chips by the fourth quarter of 2006, Taiwan...

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