India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
7min ago in ICT
China sets clear limits on payment terms to auto suppliers
7min ago in Electric Vehicles
DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices
16min ago in ICT
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
17min ago in Semiconductors
Europe's BEV running costs now 33% below ICE
17min ago in Electric Vehicles
Hermes Testing ships membrane probe cards, targets SiPh and CPO
18min ago in Semiconductors
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
18min ago in Semiconductors
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens
18min ago in Semiconductors
Samsung SDS partners with OpenAI and Anthropic in AI push
18min ago in ICT
Powerlogic revenue rises for 3rd straight month on niche demand
18min ago in ICT
Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion
19min ago in ICT
DeepSeek's next AI test is not the model; it's everything around it
19min ago in ICT
Phison pushes in-house AI solutions as August revenue surges to record high
19min ago in ICT
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
19min ago in Semiconductors
Firmus, OpenAI strike compute deal for Malaysia AI factories
19min ago in ICT
Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
19min ago in Semiconductors
Naver pitches a Europe-facing AI factory to France as Brookfield deal moves ahead
20min ago in ICT
Samsung SDS broadens AI push from software to factory robots
20min ago in ICT
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
20min ago in ICT
SK Hynix says 3D DRAM will borrow from logic foundry playbook
20min ago in Semiconductors
Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape
20min ago in ICT
China gets an early shot at the next SiC power-chip cycle
20min ago in Semiconductors
Beyond the stage, can XPeng's EV playbook scale humanoid robots?
21min ago in ICT
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on
21min ago in Semiconductors
Samsung trims foundry partner network as remaining DSPs gain momentum
21min ago in Semiconductors
Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs
21min ago in Electric Vehicles
CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap
21min ago in Semiconductors
CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks
22min ago in ICT
Apple's iPhone Duo raises the stakes for foldable smartphone cameras
22min ago in Communications
China's 6G race starts before the first 6G phone as satellite links move into the network core
23min ago in Communications
Wiwynn sees AI server shipments to overtake general-purpose servers in 3Q26
35min ago in ICT
Nanoimprint tools see a shift from round to square substrates
Sep 9, 18:45 in Tomorrow's Headlines
Shenzhen Huacheng XinGuang sees microLED optical interconnect is viable for data centers
Sep 9, 18:45 in Tomorrow's Headlines