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Major Taiwan IC backend firms developing copper pillar bumping

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Monday 27 June 2011 0

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have disclosed their respective development of copper pillar bumping, a...

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