DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices
6min ago in ICT
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
7min ago in Semiconductors
Europe's BEV running costs now 33% below ICE
7min ago in Electric Vehicles
Hermes Testing ships membrane probe cards, targets SiPh and CPO
8min ago in Semiconductors
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
8min ago in Semiconductors
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens
8min ago in Semiconductors
Samsung SDS partners with OpenAI and Anthropic in AI push
8min ago in ICT
Powerlogic revenue rises for 3rd straight month on niche demand
8min ago in ICT
Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion
9min ago in ICT
DeepSeek's next AI test is not the model; it's everything around it
9min ago in ICT
Phison pushes in-house AI solutions as August revenue surges to record high
9min ago in ICT
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
9min ago in Semiconductors
Firmus, OpenAI strike compute deal for Malaysia AI factories
9min ago in ICT
Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
9min ago in Semiconductors
Naver pitches a Europe-facing AI factory to France as Brookfield deal moves ahead
10min ago in ICT
Samsung SDS broadens AI push from software to factory robots
10min ago in ICT
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
10min ago in ICT
SK Hynix says 3D DRAM will borrow from logic foundry playbook
10min ago in Semiconductors
Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape
10min ago in ICT
China gets an early shot at the next SiC power-chip cycle
10min ago in Semiconductors
Beyond the stage, can XPeng's EV playbook scale humanoid robots?
11min ago in ICT
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on
11min ago in Semiconductors
Samsung trims foundry partner network as remaining DSPs gain momentum
11min ago in Semiconductors
Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs
11min ago in Electric Vehicles
CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap
11min ago in Semiconductors
CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks
12min ago in ICT
Apple's iPhone Duo raises the stakes for foldable smartphone cameras
12min ago in Communications
China's 6G race starts before the first 6G phone as satellite links move into the network core
13min ago in Communications
Wiwynn sees AI server shipments to overtake general-purpose servers in 3Q26
25min ago in ICT
Nanoimprint tools see a shift from round to square substrates
Sep 9, 18:45 in Tomorrow's Headlines
Shenzhen Huacheng XinGuang sees microLED optical interconnect is viable for data centers
Sep 9, 18:45 in Tomorrow's Headlines