Honor joins Taiwan foldable phone race with Magic V6
1min ago in Communications
Nextronics sees AI, robotics, medical demand reshaping revenue mix
2min ago in ICT
HPE secures US$1.2 B order from Vultr for first AMD Helios AI rack systems
5min ago in ICT
China Rare Earth Group moves downstream, linking rare-earth magnets to robot direct-drive systems
9min ago in ICT
Google to test AI computing in space with first orbital TPU launch
11min ago in Aerospace
ProLogium advances Dunkirk superfactory, deepens Europe battery autonomy
12min ago in Electric Vehicles
Micron sees no end to the memory shortage, even after new fabs open in 2028
18min ago in Semiconductors
China's humanoid robot lead widens, with domestic vendors supplying over 95% of global shipments
20min ago in ICT
Unimicron expands ABF substrate capacity with NT$10B Hukou land deal
21min ago in Semiconductors
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
22min ago in Semiconductors
Nio, Geely turn battery swapping into shared infrastructure as China's EV rivalry changes course
29min ago in Electric Vehicles
GPS-free indoor drones target high-rack inspection as smart warehouses expand
34min ago in Aerospace
AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote
42min ago in Semiconductors
AWS Trainium 3 shipments stall as supply chain sees turnaround
43min ago in ICT
Applied Materials and Kioxia team up on AI-era memory tech
44min ago in Semiconductors
Memory shortages deepen as AI demand keeps server prices climbing
48min ago in Semiconductors
SG Semiconductor builds brand and talent for Singapore chip industry
55min ago in Semiconductors
Taiwan's cement giant eyes postwar rebuilding demand
Sep 30, 18:39 in Tomorrow's Headlines
MediaTek’s TPU orders held steady as supply chain capacity became the key bottleneck
Sep 30, 18:39 in Tomorrow's Headlines
Four glass makers converge on 510x515mm substrate, hinting at TSMC’s next move
Sep 30, 18:39 in Tomorrow's Headlines